Jiangsu Profile

Product List
30571. Aluminum Alloy1100 Solarabsorb (2.5mm × 2000mm) for Concentrated Solar Power (CSP) Absorber ...
[Aug 25, 2025]

Introduction The SolarAbsorb 1100 aluminum alloy, with a thickness of 2.5mm and a width of 2000mm, is a high-purity aluminum material (approximately 99.0% aluminum, with trace amounts of silicon, iron, and copper) ...
30572. Aluminum Alloy 5052 Hydrocoat Foil (0.2mm/1200mm) for Pem Electrolyzer Bipolar Plate Substrate
[Jul 18, 2025]

Introduction The HydroCoat 5052 aluminum alloy foil, with a thickness of 0.2mm and a width of 1200mm, is likely a specialized material designed for use as a substrate for bipolar plates in Proton Exchange Membrane (PEM) ...
30573. Aluminum Alloy 3003 Aeroduct (1.2mm/1500mm) for Aircraft Ventilation Duct Substrate
[Jul 08, 2025]

Introduction The AeroDuct 3003 aluminum alloy, with a thickness of 1.2mm and a width of 1500mm, is likely a specialized material designed for stamping ventilation ducts in aircraft. Part of the 3xxx series of ...
30574. Aluminum Alloy 1060 Solarmirror (4.5mm/2000mm) for Concentrated Solar Power Reflector Substrate
[Jul 03, 2025]

Introduction The FoodGrade 1100 aluminum alloy, with a thickness of 3.0mm and a width of 1600mm, is a high-purity aluminum material (99.0% aluminum) designed for stamping commercial kitchen equipment, such as pots, ...
30575. Heatsink 1050 Aluminum Alloy (1.5mm/1500mm) for LED Heat Sink Fin Substrate
[Jul 03, 2025]

Introduction The HeatSink 1050 aluminum alloy, with a thickness of 1.5mm and a width of 1500mm, is likely a high-purity aluminum material (99.5% aluminum) designed for use as a substrate for LED heat sink fins. These ...
30576. Flexcircuit 1050 Aluminum Alloy Foil (0.1mm/1000mm) for Flexible Printed Circuit Substrate
[Jul 03, 2025]

Introduction The FlexCircuit 1050 aluminum alloy foil, with a thickness of 0.1mm and a width of 1000mm, is a high-purity aluminum material (99.5% aluminum) designed for use as a substrate in flexible printed circuits ...
30577. Flexiwrap 1100 Aluminum Alloy Foil (0.5mm/1500mm) for Electronic Tag Substrate
[Jul 01, 2025]

Introduction The FlexiWrap 1100 aluminum alloy foil, with a thickness of 0.5mm and a width of 1500mm, is a high-purity aluminum material (99.0% aluminum) designed for use as a substrate in electronic tags, such as Radio ...
30578. 1060 Aluminum Alloy Foil (0.3mm/1200mm) for Fuel Cell Bipolar Plate Substrate
[Jul 01, 2025]

Introduction The 1060 aluminum alloy foil, with a thickness of 0.3mm and a width of 1200mm, is a high-purity aluminum material (99.6% aluminum) designed for use as a substrate for fuel cell bipolar plates. Bipolar ...
30579. Multi Surface Tile Adhesive for Concrete Substrates
[Aug 20, 2025]

PRODUCT INTRODUCTION Technical Specifications Model: LETONG TILE ADHESIVE C2 Standard: EN 12004 C2 Packaging: 20kg bags custom sizes available Shelf Life: 12 months original sealed packaging; use promptly after opening ...
Company: Jiangsu Letong-Caiye Technology Development Co., Ltd.
30580. High Strength Cement Board for Flooring Substrate Solutions
[Aug 18, 2025]

PRODUCT INTRODUCTION Advantages With high fire resistance High heat preservation Non-toxic and harmless Long life Good water resistance Good interface Energy saving Environmental protection Usage Wall decoration: foam ...
Company: Jiangsu Letong-Caiye Technology Development Co., Ltd.
30581. Autofuel 3003 Aluminum Alloy (2.5mm/1750mm) for New Energy Vehicle Fuel Tank Substrate
[Jul 02, 2025]

Introduction The AutoFuel 3003 aluminum alloy, with a thickness of 2.5mm and a width of 1750mm, is likely a specialized material designed for stamping fuel tanks in new energy vehicles (NEVs), such as hybrid vehicles ...
30582. Anti-Crack Waterproof Coating for Mortar Substrate
[Aug 27, 2025]

PRODUCT INTRODUCTION Technical Specifications Product Name: JS Waterproof Coating Type: Two-component flexible waterproofing material Composition: Polymer emulsion and inorganic powders Application Areas: Bathrooms, ...
Company: Jiangsu Letong-Caiye Technology Development Co., Ltd.
30583. Pre Firing Integrated Furnace Mainly for Precision Dispensing of Aluminum Nitride Ceramic Substrates
[Feb 28, 2025]

Product Description Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other ...
30584. High Efficiency High Flexibility Die Bonding Machine Process for Placing a Chip on a Package ...
[Aug 11, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
30585. Automatic Printing Machine for Graphic Printing and Micro-Hole Filling in Ltcc or Htcc Multi-Layer ...
[Aug 13, 2025]

Product Description ZSY-200 automatic printing machine is mainly used for the graphic printing and micro-hole filling process in LTCC or HTCC multi-layer substrate manufacturing process, including such ...
