Jiangsu Profile
Product List
30616. Flexiwrap 1100 Aluminum Alloy Foil (0.5mm/1500mm) for Electronic Tag Substrate 
[Jul 01, 2025]
[Jul 01, 2025] Introduction The FlexiWrap 1100 aluminum alloy foil, with a thickness of 0.5mm and a width of 1500mm, is a high-purity aluminum material (99.0% aluminum) designed for use as a substrate in electronic tags, such as Radio ...
30617. 1060 Aluminum Alloy Foil (0.3mm/1200mm) for Fuel Cell Bipolar Plate Substrate [Jul 01, 2025]
[Jul 01, 2025] Introduction The 1060 aluminum alloy foil, with a thickness of 0.3mm and a width of 1200mm, is a high-purity aluminum material (99.6% aluminum) designed for use as a substrate for fuel cell bipolar plates. Bipolar ...
30618. Multi Surface Tile Adhesive for Concrete Substrates [Aug 20, 2025]
[Aug 20, 2025] PRODUCT INTRODUCTION Technical Specifications Model: LETONG TILE ADHESIVE C2 Standard: EN 12004 C2 Packaging: 20kg bags custom sizes available Shelf Life: 12 months original sealed packaging; use promptly after opening ...
Company: Jiangsu Letong-Caiye Technology Development Co., Ltd.
30619. High Strength Cement Board for Flooring Substrate Solutions [Aug 18, 2025]
[Aug 18, 2025] PRODUCT INTRODUCTION Advantages With high fire resistance High heat preservation Non-toxic and harmless Long life Good water resistance Good interface Energy saving Environmental protection Usage Wall decoration: foam ...
Company: Jiangsu Letong-Caiye Technology Development Co., Ltd.
30620. Autofuel 3003 Aluminum Alloy (2.5mm/1750mm) for New Energy Vehicle Fuel Tank Substrate [Jul 02, 2025]
[Jul 02, 2025] Introduction The AutoFuel 3003 aluminum alloy, with a thickness of 2.5mm and a width of 1750mm, is likely a specialized material designed for stamping fuel tanks in new energy vehicles (NEVs), such as hybrid vehicles ...
30621. Anti-Crack Waterproof Coating for Mortar Substrate [Aug 27, 2025]
[Aug 27, 2025] PRODUCT INTRODUCTION Technical Specifications Product Name: JS Waterproof Coating Type: Two-component flexible waterproofing material Composition: Polymer emulsion and inorganic powders Application Areas: Bathrooms, ...
Company: Jiangsu Letong-Caiye Technology Development Co., Ltd.
30622. Pre Firing Integrated Furnace Mainly for Precision Dispensing of Aluminum Nitride Ceramic Substrates [Feb 28, 2025]
[Feb 28, 2025] Product Description Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other ...
30623. High Efficiency High Flexibility Die Bonding Machine Process for Placing a Chip on a Package ... [Aug 11, 2025]
[Aug 11, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
30624. Automatic Printing Machine for Graphic Printing and Micro-Hole Filling in Ltcc or Htcc Multi-Layer ... [Aug 13, 2025]
[Aug 13, 2025] Product Description ZSY-200 automatic printing machine is mainly used for the graphic printing and micro-hole filling process in LTCC or HTCC multi-layer substrate manufacturing process, including such ...
30625. 50-250μ M Polyester Film for Intesoft Composite Material Substrate (6023D-1) [Jul 08, 2025]
[Jul 08, 2025] Product Description Standard thickness 50μm,75μm,100μm,125μm,150μm,188μm,200μm,250μm. Other thickness can be customized according to customer's specific requirement. Product feature and ...
30626. 300micron-500micron Milky White Translucent BOPET Pet Film for Oft Composite Material Substrate [Jun 27, 2025]
[Jun 27, 2025] Product Description Standard thickness 300μm,350μm,400μm,450μm,500μm. Other thickness can be customized according to customer's specific requirement. Product feature and purpose Milky white ...
30627. 3105 Aluminum Coil 1.6mm/1300mm Used for Air Conditioner Radiator Substrate [May 15, 2025]
[May 15, 2025] Product Description Product Description:Material: 3105 aluminum manganese alloy (Mn 0.5-1.0%, Mg 0.2-0.8%), thickness 1.6mm, width 1300mm, state H14 (semi hard state) Core features: Thermal conductivity: 193 W/(m ...
30628. Linear High-Speed Die Attach Die Bonder for Different Kinds of Lead Frames & Substrates [Aug 14, 2025]
[Aug 14, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
30629. Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing [Jul 22, 2025]
[Jul 22, 2025] Product DescriptionThe mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal honeycomb ...
30630. Modern Techniques Cutting Unit for No Substrate, 3m467, Oca [Jul 07, 2025]
[Jul 07, 2025] Modern Techniques Cutting Unit for no substrate,3M467, OCA Product Description The unit of our company adopts a unique fixed design to achieve stable cutting. It can be designed and manufactured according to ...
