Jiangsu Profile
Product List
30706. 300micron-500micron Milky White Translucent BOPET Pet Film for Oft Composite Material Substrate 
[Jun 27, 2025]
[Jun 27, 2025] Product Description Standard thickness 300μm,350μm,400μm,450μm,500μm. Other thickness can be customized according to customer's specific requirement. Product feature and purpose Milky white ...
30707. 3105 Aluminum Coil 1.6mm/1300mm Used for Air Conditioner Radiator Substrate [May 15, 2025]
[May 15, 2025] Product Description Product Description:Material: 3105 aluminum manganese alloy (Mn 0.5-1.0%, Mg 0.2-0.8%), thickness 1.6mm, width 1300mm, state H14 (semi hard state) Core features: Thermal conductivity: 193 W/(m ...
30708. Linear High-Speed Die Attach Die Bonder for Different Kinds of Lead Frames & Substrates [Aug 14, 2025]
[Aug 14, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
30709. Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing [Jul 22, 2025]
[Jul 22, 2025] Product DescriptionThe mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal honeycomb ...
30710. Modern Techniques Cutting Unit for No Substrate, 3m467, Oca [Jul 07, 2025]
[Jul 07, 2025] Modern Techniques Cutting Unit for no substrate,3M467, OCA Product Description The unit of our company adopts a unique fixed design to achieve stable cutting. It can be designed and manufactured according to ...
30711. 1060 Aluminum Alloy/2.5mm/1500mm Curtain Wall Substrate Fluorocarbon Spraying [Apr 22, 2025]
[Apr 22, 2025] Product Description Product Description:Substrate properties: The ultimate balance of industrial pure aluminum Composition: 1060 aluminum alloy (Al≥99.6%), density 2.7g/cm³, tensile strength ≥70MPa, ...
30712. Soft Composite Substrate Insulation Between Motor Slots 100-500μ M Insulation Pet Film with UL ... [Jul 08, 2025]
[Jul 08, 2025] Product Description Standard thickness 100μm,125μm,150μm,188μm,250μm,300μm,350μm,500μm. Other thickness can be customized according to customer's specific requirement. Product feature and ...
30713. Yuxing Electrical Insulation Pet Film Insulating Gasket for Electrical Products Soft Composite ... [Jul 04, 2025]
[Jul 04, 2025] Product Description Standard thickness 50μm,75μm,100μm,125μm,150μm,188μm,200μm,250μm. Other thickness can be customized according to customer's specific requirement. Product feature and ...
30714. High Quality Hard-Brittle Material Substrates Cutting Equipment [Jul 22, 2025]
[Jul 22, 2025] High Quality Hard-Brittle Material Substrates Cutting Equipment Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical ...
30715. Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning oscillator & Mechanical + CCD positioning to ensure marking accuracy Robotic ...
30716. Substrate Display Glass C500 Semiconductor Equipment Is Mainly Used in Display Industry [Jul 22, 2025]
[Jul 22, 2025] Product Description Tool Spec Machine Type Cluster ALD Substrate Display Glass Temperature 150-250ºC Depo Rate 0.33nm/min Plasma Source CCP Injection Type Shower head Leak ...
30717. PCBA Laser Marking Machine for Large-Size PCBA Boards and Packaging Substrates [Jul 22, 2025]
[Jul 22, 2025] PCBA Laser Marking Machine for Large-Size PCBA Boards and Packaging Substrates Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet ...
30718. Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp ... [Aug 14, 2025]
[Aug 14, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
30719. High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine [Jul 22, 2025]
[Jul 22, 2025] High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning ...
30720. Insulation Between Motor Slots Interturn Insulation Soft Composite Substrate Translucent Insulation ... [Jul 04, 2025]
[Jul 04, 2025] Product Description Standard thickness 50μm,75μm,100μm,125μm,150μm,188μm,200μm,250μm. Other thickness can be customized according to customer's specific requirement. Product feature and ...
