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Anti-Crack Waterproof Coating for Mortar Substrate
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30721.

Anti-Crack Waterproof Coating for Mortar Substrate Open Details in New Window [Aug 27, 2025]

PRODUCT INTRODUCTION Technical Specifications Product Name: JS Waterproof Coating Type: Two-component flexible waterproofing material Composition: Polymer emulsion and inorganic powders Application Areas: Bathrooms, ...

Company: Jiangsu Letong-Caiye Technology Development Co., Ltd.

Pre Firing Integrated Furnace Mainly for Precision Dispensing of Aluminum Nitride Ceramic Substrates
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30722.

Pre Firing Integrated Furnace Mainly for Precision Dispensing of Aluminum Nitride Ceramic Substrates Open Details in New Window [Feb 28, 2025]

Product Description Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Efficiency High Flexibility Die Bonding Machine Process for Placing a Chip on a Package ...
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30723.

High Efficiency High Flexibility Die Bonding Machine Process for Placing a Chip on a Package ... Open Details in New Window [Aug 11, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Printing Machine for Graphic Printing and Micro-Hole Filling in Ltcc or Htcc Multi-Layer ...
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30724.

Automatic Printing Machine for Graphic Printing and Micro-Hole Filling in Ltcc or Htcc Multi-Layer ... Open Details in New Window [Aug 13, 2025]

Product Description ZSY-200 automatic printing machine is mainly used for the graphic printing and micro-hole filling process in LTCC or HTCC multi-layer substrate manufacturing process, including such ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

50-250μ M Polyester Film for Intesoft Composite Material Substrate (6023D-1)
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30725.

50-250μ M Polyester Film for Intesoft Composite Material Substrate (6023D-1) Open Details in New Window [Jul 08, 2025]

Product Description Standard thickness 50μm,75μm,100μm,125μm,150μm,188μm,200μm,250μm. Other thickness can be customized according to customer's specific requirement. Product feature and ...

Company: Jiangsu Yuxing Film Technology Co., Ltd.

300micron-500micron Milky White Translucent BOPET Pet Film for Oft Composite Material Substrate
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30726.

300micron-500micron Milky White Translucent BOPET Pet Film for Oft Composite Material Substrate Open Details in New Window [Jun 27, 2025]

Product Description Standard thickness 300μm,350μm,400μm,450μm,500μm. Other thickness can be customized according to customer's specific requirement. Product feature and purpose Milky white ...

Company: Jiangsu Yuxing Film Technology Co., Ltd.

3105 Aluminum Coil 1.6mm/1300mm Used for Air Conditioner Radiator Substrate
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30727.

3105 Aluminum Coil 1.6mm/1300mm Used for Air Conditioner Radiator Substrate Open Details in New Window [May 15, 2025]

Product Description Product Description:Material: 3105 aluminum manganese alloy (Mn 0.5-1.0%, Mg 0.2-0.8%), thickness 1.6mm, width 1300mm, state H14 (semi hard state) Core features: Thermal conductivity: 193 W/(m ...

Company: CHANGZHOU DINGANG METAL MATERIAL CO., LTD.

Linear High-Speed Die Attach Die Bonder for Different Kinds of Lead Frames & Substrates
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30728.

Linear High-Speed Die Attach Die Bonder for Different Kinds of Lead Frames & Substrates Open Details in New Window [Aug 14, 2025]

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing
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30729.

Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing Open Details in New Window [Jul 22, 2025]

Product DescriptionThe mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal honeycomb ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Modern Techniques Cutting Unit for No Substrate, 3m467, Oca
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30730.

Modern Techniques Cutting Unit for No Substrate, 3m467, Oca Open Details in New Window [Jul 07, 2025]

Modern Techniques Cutting Unit for no substrate,3M467, OCA Product Description The unit of our company adopts a unique fixed design to achieve stable cutting. It can be designed and manufactured according to ...

Company: JetFly Precision Manufacturing Co., Ltd.

1060 Aluminum Alloy/2.5mm/1500mm Curtain Wall Substrate Fluorocarbon Spraying
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30731.

1060 Aluminum Alloy/2.5mm/1500mm Curtain Wall Substrate Fluorocarbon Spraying Open Details in New Window [Apr 22, 2025]

Product Description Product Description:Substrate properties: The ultimate balance of industrial pure aluminum Composition: 1060 aluminum alloy (Al≥99.6%), density 2.7g/cm³, tensile strength ≥70MPa, ...

Company: CHANGZHOU DINGANG METAL MATERIAL CO., LTD.

Soft Composite Substrate Insulation Between Motor Slots 100-500μ M Insulation Pet Film with UL ...
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30732.

Soft Composite Substrate Insulation Between Motor Slots 100-500μ M Insulation Pet Film with UL ... Open Details in New Window [Jul 08, 2025]

Product Description Standard thickness 100μm,125μm,150μm,188μm,250μm,300μm,350μm,500μm. Other thickness can be customized according to customer's specific requirement. Product feature and ...

Company: Jiangsu Yuxing Film Technology Co., Ltd.

Yuxing Electrical Insulation Pet Film Insulating Gasket for Electrical Products Soft Composite ...
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30733.

Yuxing Electrical Insulation Pet Film Insulating Gasket for Electrical Products Soft Composite ... Open Details in New Window [Jul 04, 2025]

Product Description Standard thickness 50μm,75μm,100μm,125μm,150μm,188μm,200μm,250μm. Other thickness can be customized according to customer's specific requirement. Product feature and ...

Company: Jiangsu Yuxing Film Technology Co., Ltd.

High Quality Hard-Brittle Material Substrates Cutting Equipment
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30734.

High Quality Hard-Brittle Material Substrates Cutting Equipment Open Details in New Window [Jul 22, 2025]

High Quality Hard-Brittle Material Substrates Cutting Equipment Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator
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30735.

Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator Open Details in New Window [Jul 22, 2025]

Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning oscillator & Mechanical + CCD positioning to ensure marking accuracy Robotic ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.