Jiangsu Profile
Product List
44686. Hot Sale Leveling Agent Tego-245 for solvent-based or water-based coatings 
[Dec 30, 2025]
[Dec 30, 2025] Product Description [Introduction] Polyether modified polysiloxane [Product Description] It is a specially modified polyether siloxane copolymer, which has excellent wetting effect. It improves the distribution ...
44687. Hot Sale Leveling Agent BYK-306 for wood coatings and furniture coatings [Dec 30, 2025]
[Dec 30, 2025] Product Description [Introduction] Polyether Modified Polysiloxane Solution. [Product Description] (1) It can reduce the surface tension of the coating and provide a high-efficiency silicone surface additive with good ...
44688. China Factory Leveling Agent Tego-245 for solvent-based or water-based coatings [Dec 29, 2025]
[Dec 29, 2025] Product Description [Introduction] Polyether modified polysiloxane [Product Description] It is a specially modified polyether siloxane copolymer, which has excellent wetting effect. It improves the distribution ...
44689. China Factory Leveling Agent BYK-306 for wood coatings and furniture coatings [Dec 29, 2025]
[Dec 29, 2025] Product Description [Introduction] Polyether Modified Polysiloxane Solution. [Product Description] (1) It can reduce the surface tension of the coating and provide a high-efficiency silicone surface additive with good ...
44690. Precision Wire Bonder for Power Devices and Innovative Packaging [Dec 23, 2025]
[Dec 23, 2025] Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x ...
44691. Factory Production Polyethylene Glycol 400 (PEG400) HO (CH2CH2O) nH [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] RB-PEG400 is a polymer with the chemical formula HO (CH2CH2O) nH. It is non irritating, slightly bitter in taste, has good water solubility, and has good compatibility with many ...
44692. Manufacturer Supply Polyethylene Glycol 400 (PEG400) HO (CH2CH2O) nH [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] RB-PEG400 is a polymer with the chemical formula HO (CH2CH2O) nH. It is non irritating, slightly bitter in taste, has good water solubility, and has good compatibility with many ...
44693. Factory Production Leveling Agent Tego-245 for solvent-based or water-based coatings [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether modified polysiloxane [Product Description] It is a specially modified polyether siloxane copolymer, which has excellent wetting effect. It improves the distribution ...
44694. Manufacturer Supply Leveling Agent Tego-245 for solvent-based or water-based coatings [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether modified polysiloxane [Product Description] It is a specially modified polyether siloxane copolymer, which has excellent wetting effect. It improves the distribution ...
44695. Factory Production Leveling Agent BYK-306 for wood coatings and furniture coatings [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether Modified Polysiloxane Solution. [Product Description] (1) It can reduce the surface tension of the coating and provide a high-efficiency silicone surface additive with good ...
44696. Manufacturer Supply Leveling Agent BYK-306 for wood coatings and furniture coatings [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether Modified Polysiloxane Solution. [Product Description] (1) It can reduce the surface tension of the coating and provide a high-efficiency silicone surface additive with good ...
44697. Precision Laminator System Tailored for Semiconductor Industry Use [Dec 19, 2025]
[Dec 19, 2025] Product Description Manual Film Laminator Series Product Description Product Overview This manual film laminator series is engineered for fast and efficient application of protective film onto wafers, glass, ...
44698. High-Speed LED Wafer Die Bonder for Semiconductor Manufacturing [Dec 19, 2025]
[Dec 19, 2025] Discover the revolutionary Dual Head Dispensing High-Speed LED Clip Wafer Die Bonder, a pinnacle of precision and efficiency from Jiangsu Himalaya Semiconductor Co., Ltd. Embrace advanced semiconductor bonding with this ...
44699. Advanced 6 to 10 Inch Semiconductor Bonding Equipment Solutions [Dec 19, 2025]
[Dec 19, 2025] Product Description Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving ...
44700. High-Precision Laser Marking System for BGA and LGA Components [Jan 04, 2026]
[Jan 04, 2026] High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning oscillator ...
