Jiangsu Profile
Product List
44746. Factory Production Leveling Agent Tego-245 for solvent-based or water-based coatings 
[Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether modified polysiloxane [Product Description] It is a specially modified polyether siloxane copolymer, which has excellent wetting effect. It improves the distribution ...
44747. Manufacturer Supply Leveling Agent Tego-245 for solvent-based or water-based coatings [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether modified polysiloxane [Product Description] It is a specially modified polyether siloxane copolymer, which has excellent wetting effect. It improves the distribution ...
44748. Factory Production Leveling Agent BYK-306 for wood coatings and furniture coatings [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether Modified Polysiloxane Solution. [Product Description] (1) It can reduce the surface tension of the coating and provide a high-efficiency silicone surface additive with good ...
44749. Manufacturer Supply Leveling Agent BYK-306 for wood coatings and furniture coatings [Dec 26, 2025]
[Dec 26, 2025] Product Description [Introduction] Polyether Modified Polysiloxane Solution. [Product Description] (1) It can reduce the surface tension of the coating and provide a high-efficiency silicone surface additive with good ...
44750. Precision Laminator System Tailored for Semiconductor Industry Use [Dec 19, 2025]
[Dec 19, 2025] Product Description Manual Film Laminator Series Product Description Product Overview This manual film laminator series is engineered for fast and efficient application of protective film onto wafers, glass, ...
44751. High-Speed LED Wafer Die Bonder for Semiconductor Manufacturing [Dec 19, 2025]
[Dec 19, 2025] Discover the revolutionary Dual Head Dispensing High-Speed LED Clip Wafer Die Bonder, a pinnacle of precision and efficiency from Jiangsu Himalaya Semiconductor Co., Ltd. Embrace advanced semiconductor bonding with this ...
44752. Advanced 6 to 10 Inch Semiconductor Bonding Equipment Solutions [Dec 19, 2025]
[Dec 19, 2025] Product Description Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving ...
44753. High-Precision Laser Marking System for BGA and LGA Components [Jan 04, 2026]
[Jan 04, 2026] High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning oscillator ...
44754. Smart Automatic Laser Debonding Solution for Quick Turnaround [Jan 04, 2026]
[Jan 04, 2026] Automatic Compensation Laser Debonding/Stripping Machine with Real-Time Monitoring Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding ...
44755. High-Precision Laser Marking Machine with Smart Detection Features [Jan 04, 2026]
[Jan 04, 2026] Fully Automatic Substrate Laser Marking Equipment with Anti-Reverse Detection Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital ...
44756. Advanced Zdp-8 Laminating System for Seamless and Durable Outputs [Jan 04, 2026]
[Jan 04, 2026] Zdp-8 Automatic Laminating Machine with The Inter-Layer Precision Alignment Product Description ZDP-8 automatic laminating machine is one of the key equipment in the LTCC multi-layer substrate manufacturing ...
44757. Advanced Automatic Laser Drilling Machine for Glass and Ceramics [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
44758. Multi-Station Vertical Semiconductor Wafer Dryer [Dec 13, 2025]
[Dec 13, 2025] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
44759. Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip ...
44760. Advanced Plasma Cleaner for Efficient Wafer Photoresist Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
