Jiangsu Profile
Product List
44791. Advanced 6 to 10 Inch Semiconductor Bonding Equipment Solutions 
[Dec 19, 2025]
[Dec 19, 2025] Product Description Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving ...
44792. High-Precision Laser Marking System for BGA and LGA Components [Jan 04, 2026]
[Jan 04, 2026] High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning oscillator ...
44793. Smart Automatic Laser Debonding Solution for Quick Turnaround [Jan 04, 2026]
[Jan 04, 2026] Automatic Compensation Laser Debonding/Stripping Machine with Real-Time Monitoring Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding ...
44794. High-Precision Laser Marking Machine with Smart Detection Features [Jan 04, 2026]
[Jan 04, 2026] Fully Automatic Substrate Laser Marking Equipment with Anti-Reverse Detection Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital ...
44795. Advanced Zdp-8 Laminating System for Seamless and Durable Outputs [Jan 04, 2026]
[Jan 04, 2026] Zdp-8 Automatic Laminating Machine with The Inter-Layer Precision Alignment Product Description ZDP-8 automatic laminating machine is one of the key equipment in the LTCC multi-layer substrate manufacturing ...
44796. Advanced Automatic Laser Drilling Machine for Glass and Ceramics [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
44797. Multi-Station Vertical Semiconductor Wafer Dryer [Dec 13, 2025]
[Dec 13, 2025] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
44798. Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip ...
44799. Advanced Plasma Cleaner for Efficient Wafer Photoresist Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
44800. High-Precision FPCB Laser Cutting and Placement System for Production [Dec 13, 2025]
[Dec 13, 2025] High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, circuit board ...
44801. Efficient High-Speed Die Bonder for Semiconductor Assembly Lines [Dec 13, 2025]
[Dec 13, 2025] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding ...
44802. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
44803. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
44804. Manual Vacuum Wafer Laminator Mounting Machine for Semiconductor Wafer Thinning [Dec 13, 2025]
[Dec 13, 2025] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate heating temperature 0~65ºC ...
44805. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Dec 13, 2025]
[Dec 13, 2025] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
