Jiangsu Profile
Product List
44881. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price 
[Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
44882. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
44883. Manual Vacuum Wafer Laminator Mounting Machine for Semiconductor Wafer Thinning [Dec 13, 2025]
[Dec 13, 2025] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate heating temperature 0~65ºC ...
44884. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Dec 13, 2025]
[Dec 13, 2025] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
44885. 12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly [Dec 13, 2025]
[Dec 13, 2025] 12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
44886. Fully Automatic Clip Bonder Machine Manufacturer Die Bonding Equipment [Dec 13, 2025]
[Dec 13, 2025] Fully automatic Clip Bonder machine manufacturer die bonding equipment The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment ...
44887. High Precision Die Bonding Machine for PCB and IC Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
44888. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
44889. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Dec 13, 2025]
[Dec 13, 2025] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
44890. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
44891. PCB Laser Marking Systems for Electronics Manufacturing [Dec 13, 2025]
[Dec 13, 2025] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Automated PCB Laser Marking System Precision Marking for Electronics Manufacturing Our PCB Laser Marking Systems provide ...
44892. High Precision Laser Cutting System for Semiconductor Wafers [Dec 13, 2025]
[Dec 13, 2025] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
44893. Mopa Fiber Laser Marking Machine for IC or Chip Marking Factory Price [Dec 13, 2025]
[Dec 13, 2025] Product Description HMLA-G Series Fiber Laser Marking Machine - Specification Sheet Category Specification Details Model Series Name HMLA-G Series Laser Source Type MOPA Fiber Laser Wavelength 1.06 μm (Infrared) ...
44894. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Dec 13, 2025]
[Dec 13, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
44895. Advanced Plasma Asher for Efficient Wafer Glue Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
