Jiangsu Profile
Product List
44911. 12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly 
[Dec 13, 2025]
[Dec 13, 2025] 12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
44912. Fully Automatic Clip Bonder Machine Manufacturer Die Bonding Equipment [Dec 13, 2025]
[Dec 13, 2025] Fully automatic Clip Bonder machine manufacturer die bonding equipment The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment ...
44913. High Precision Die Bonding Machine for PCB and IC Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
44914. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
44915. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Dec 13, 2025]
[Dec 13, 2025] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
44916. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
44917. PCB Laser Marking Systems for Electronics Manufacturing [Dec 13, 2025]
[Dec 13, 2025] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Automated PCB Laser Marking System Precision Marking for Electronics Manufacturing Our PCB Laser Marking Systems provide ...
44918. High Precision Laser Cutting System for Semiconductor Wafers [Dec 13, 2025]
[Dec 13, 2025] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
44919. Mopa Fiber Laser Marking Machine for IC or Chip Marking Factory Price [Dec 13, 2025]
[Dec 13, 2025] Product Description HMLA-G Series Fiber Laser Marking Machine - Specification Sheet Category Specification Details Model Series Name HMLA-G Series Laser Source Type MOPA Fiber Laser Wavelength 1.06 μm (Infrared) ...
44920. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Dec 13, 2025]
[Dec 13, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
44921. Advanced Plasma Asher for Efficient Wafer Glue Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
44922. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment [Dec 13, 2025]
[Dec 13, 2025] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
44923. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Dec 13, 2025]
[Dec 13, 2025] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
44924. CCD Vision Automatic Alignment Potting Glue Dispensing Machine for LED/Semiconductor [Dec 13, 2025]
[Dec 13, 2025] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing ...
44925. Laser Trimming System Machine for Semiconductor Wafer Trimming Thick/Thin-Film Resistors [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
