Jiangsu Profile
Product List
44971. High Precision Laser Cutting System for Semiconductor Wafers 
[Dec 13, 2025]
[Dec 13, 2025] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
44972. Mopa Fiber Laser Marking Machine for IC or Chip Marking Factory Price [Dec 13, 2025]
[Dec 13, 2025] Product Description HMLA-G Series Fiber Laser Marking Machine - Specification Sheet Category Specification Details Model Series Name HMLA-G Series Laser Source Type MOPA Fiber Laser Wavelength 1.06 μm (Infrared) ...
44973. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Dec 13, 2025]
[Dec 13, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
44974. Advanced Plasma Asher for Efficient Wafer Glue Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
44975. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment [Dec 13, 2025]
[Dec 13, 2025] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
44976. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Dec 13, 2025]
[Dec 13, 2025] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
44977. CCD Vision Automatic Alignment Potting Glue Dispensing Machine for LED/Semiconductor [Dec 13, 2025]
[Dec 13, 2025] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing ...
44978. Laser Trimming System Machine for Semiconductor Wafer Trimming Thick/Thin-Film Resistors [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
44979. High Quality Laser Making/Markig Machine for FPC/PCB Board with Innovative Processing Technology [Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
44980. High-Precision Flip PCB Laser Marking Machine for Mobile Devices [Dec 13, 2025]
[Dec 13, 2025] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer ...
44981. Epoxy Polyurethane Silicone Dispenser CCD Automated Aligning Glue Dispensing Robot [Dec 13, 2025]
[Dec 13, 2025] High Quality Industrial Dispensing Automation Robot Used for Semiconductor Packaging/SMT Assembly Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
44982. Flexible Screen UV Picosecond Laser Cutting Machine for OLED or LCD [Dec 13, 2025]
[Dec 13, 2025] Product Description Flexible Screen UV Laser Cutting Machine A Flexible Screen UV Laser Cutting Machine is a specialized piece of equipment designed for cutting flexible displays. It utilizes ultraviolet (UV) laser ...
44983. High-Speed Automatic Die Attach Equipment for Precision Bonding [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
44984. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Dec 13, 2025]
[Dec 13, 2025] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
44985. SMA Rg316 Coaxial Cable Assembly SMA Male Right-Angle [Jan 04, 2026]
[Jan 04, 2026] Product Parameters Precision Machining,Process Specification 1.Pure Brass is used as the Substrate, and the Shell is Treated with Nickel Plating, Which has Good Wear Resistance. 2.Threads and Inner Conductors ...
