Jiangsu Profile
Product List
47206. Agricultural Hydroponic 1.5 Inch 98 Cubes Rock Wool Grow Sheets 
[Jul 17, 2026]
[Jul 17, 2026] Product Description ZRD agriculture rock wool cubes are formulated for propagating tomato and cucumber advanced seedlings and planting medical hemp. They feature a standard-size rock wool pre-cut planting hole for easy ...
Company: Nanjing Zhongrunda New Material Technology Co., Ltd.
47207. 4X4X4 Inch Upuper Quality Cultivation Rock Wool Agricultural Seeding Sheet [Jul 17, 2026]
[Jul 17, 2026] Product Description ZRD agriculture rock wool cubes are formulated for propagating tomato and cucumber advanced seedlings and planting medical hemp. They feature a standard-size rock wool pre-cut planting hole for easy ...
Company: Nanjing Zhongrunda New Material Technology Co., Ltd.
47208. 4" Inch Growing Rock Mineral Wool for Agriculture Usage [Jul 17, 2026]
[Jul 17, 2026] Product Description ZRD agriculture rock wool cubes are formulated for propagating tomato and cucumber advanced seedlings and planting medical hemp. They feature a standard-size rock wool pre-cut planting hole for easy ...
Company: Nanjing Zhongrunda New Material Technology Co., Ltd.
47209. Mineral Wool Board Insulation Agriculture Price Stone Wool Board [Jul 17, 2026]
[Jul 17, 2026] Product Description ZRD agriculture rock wool cubes are formulated for propagating tomato and cucumber advanced seedlings and planting medical hemp. They feature a standard-size rock wool pre-cut planting hole for easy ...
Company: Nanjing Zhongrunda New Material Technology Co., Ltd.
47210. Fully Automatic Die Bonding Machine System Manufacturer [Jul 16, 2026]
[Jul 16, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
47211. Advanced Manual Wafer Film Mounter for LED and PCB Applications [Jul 16, 2026]
[Jul 16, 2026] Product Description The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving design significantly ...
47212. Advanced Automatic X-ray Detection System for BGA Components [Jul 16, 2026]
[Jul 16, 2026] In-line X-Ray Inspection System - Product Introduction Product Description This system is a high-precision in-line X-Ray inspection system specifically engineered for the meticulous inspection of BGA (Ball Grid ...
47213. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Jul 16, 2026]
[Jul 16, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
47214. Advanced Wafer Laser Lift-off System for GaN Layer Separation [Jul 15, 2026]
[Jul 15, 2026] Product Description SLO-V3080A LED Laser Lift-Off Equipment The SLO-V3080A is a state-of-the-art laser lift-off (LLO) system engineered for high-volume, high-yield production of LED devices. It is designed to perform ...
47215. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Jul 15, 2026]
[Jul 15, 2026] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
47216. Advanced CCD Vision Glue Dispensing System for LED and Semiconductor Potting [Jul 15, 2026]
[Jul 15, 2026] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated ...
47217. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Jul 14, 2026]
[Jul 14, 2026] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
47218. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Jul 13, 2026]
[Jul 13, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
47219. Advanced Semiconductor Wafer Marking System with Visual Guidance [Aug 04, 2026]
[Aug 04, 2026] Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional ...
47220. Misting System for Optimal Cooling and Moisture Balance [Aug 04, 2026]
[Aug 04, 2026] Product Description Product Name Component Brand Parameters Constant Pressure Pump Unit Variable Frequency Control Cabinet NSTG Inovance PLC+ 7-inch Touch Screen + Inovance Inverter+ Basic Electrical Components Unit ...
Company: Nstg Agri-Tech Group Co., Ltd.
