Jiangsu Substrate products, Jiangsu Substrate manufacturers & suppliers page3151

Advanced Manual Wafer Film Mounter for LED and PCB Applications

47251.

Advanced Manual Wafer Film Mounter for LED and PCB Applications [Jul 16, 2026]

Product Description The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving design significantly ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Automatic X-ray Detection System for BGA Components

47252.

Advanced Automatic X-ray Detection System for BGA Components [Jul 16, 2026]

In-line X-Ray Inspection System - Product Introduction Product Description This system is a high-precision in-line X-Ray inspection system specifically engineered for the meticulous inspection of BGA (Ball Grid ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging

47253.

Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Jul 16, 2026]

Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Wafer Laser Lift-off System for GaN Layer Separation

47254.

Advanced Wafer Laser Lift-off System for GaN Layer Separation [Jul 15, 2026]

Product Description SLO-V3080A LED Laser Lift-Off Equipment The SLO-V3080A is a state-of-the-art laser lift-off (LLO) system engineered for high-volume, high-yield production of LED devices. It is designed to perform ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Achieve Perfect Alignment with Precision Wafer Mounting Equipment System

47255.

Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Jul 15, 2026]

Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced CCD Vision Glue Dispensing System for LED and Semiconductor Potting

47256.

Advanced CCD Vision Glue Dispensing System for LED and Semiconductor Potting [Jul 15, 2026]

High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA

47257.

Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Jul 14, 2026]

Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price

47258.

High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Jul 13, 2026]

Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Semiconductor Wafer Marking System with Visual Guidance

47259.

Advanced Semiconductor Wafer Marking System with Visual Guidance [Aug 04, 2026]

Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.