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Precision Laser Trimming Technology for Circuit Chip Manufacturing
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82036.

Precision Laser Trimming Technology for Circuit Chip Manufacturing Open Details in New Window [Sep 17, 2026]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Trimming Technology for Semiconductor Wafer Processing
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82037.

Precision Laser Trimming Technology for Semiconductor Wafer Processing Open Details in New Window [Sep 17, 2026]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Compact Vision Dispensing System for Efficient Small Batch Production
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82038.

Compact Vision Dispensing System for Efficient Small Batch Production Open Details in New Window [Sep 17, 2026]

Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Versatile Gantry Wire Bonder Machine for Precision Assembly
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82039.

Versatile Gantry Wire Bonder Machine for Precision Assembly Open Details in New Window [Sep 17, 2026]

Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Diamond Fly Cutting Machine Aerostatic Spindle Polygon Mirror Optical Applications
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82040.

High Precision Diamond Fly Cutting Machine Aerostatic Spindle Polygon Mirror Optical Applications Open Details in New Window [Sep 16, 2026]

PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...

Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.

Long Lifespan Custom Small-Aperture Magnetorheological Finishing Machine for Infrared Imaging
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82041.

Long Lifespan Custom Small-Aperture Magnetorheological Finishing Machine for Infrared Imaging Open Details in New Window [Sep 09, 2026]

PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...

Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.

High-Precision Laser Cutter for Thin Metal Fabrication Solutions
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82042.

High-Precision Laser Cutter for Thin Metal Fabrication Solutions Open Details in New Window [Sep 30, 2026]

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal Product Description Product overview: MPS-0606LM is a product specially for the small format precision laser cutting market. It is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Versatile CO2 Laser Cutter for Creative DIY Art Projects
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82043.

Versatile CO2 Laser Cutter for Creative DIY Art Projects Open Details in New Window [Sep 30, 2026]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Seamless Butyl Adhesive Coating Machine for Precision Applications
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82044.

Advanced Seamless Butyl Adhesive Coating Machine for Precision Applications Open Details in New Window [Sep 30, 2026]

Features •The glue process only melts the top part of the barrel glue and the remaining material remains solid, reducing the influence of thermal stress on the original characteristics ot the glue; •The ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Single Mode Fiber Alignment System for Optimal Performance
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82045.

High Precision Single Mode Fiber Alignment System for Optimal Performance Open Details in New Window [Sep 30, 2026]

Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling efficiency ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
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82046.

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Open Details in New Window [Sep 30, 2026]

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Pkc300-Q Compact Small-Aperture Optics Magnetorheological Finishing Mrf Machine
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82047.

High-Precision Pkc300-Q Compact Small-Aperture Optics Magnetorheological Finishing Mrf Machine Open Details in New Window [Sep 09, 2026]

PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...

Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.

High-Speed Die Bonder for Efficient Semiconductor Manufacturing Solutions
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82048.

High-Speed Die Bonder for Efficient Semiconductor Manufacturing Solutions Open Details in New Window [Sep 08, 2026]

High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced GaN Polishing Tools for High-Quality Sic Wafer Production
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82049.

Advanced GaN Polishing Tools for High-Quality Sic Wafer Production Open Details in New Window [Sep 28, 2026]

Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Laser Engraving Machine for Custom Marking
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82050.

Advanced Precision Laser Engraving Machine for Custom Marking Open Details in New Window [Sep 28, 2026]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.