Jiangsu Profile
Product List
82051. Precision Laser Trimming Technology for Semiconductor Wafer Processing 
[Sep 17, 2026]
[Sep 17, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
82052. Compact Vision Dispensing System for Efficient Small Batch Production [Sep 17, 2026]
[Sep 17, 2026] Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor ...
82053. Versatile Gantry Wire Bonder Machine for Precision Assembly [Sep 17, 2026]
[Sep 17, 2026] Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to ...
82054. High Precision Diamond Fly Cutting Machine Aerostatic Spindle Polygon Mirror Optical Applications [Sep 16, 2026]
[Sep 16, 2026] PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...
Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.
82055. Long Lifespan Custom Small-Aperture Magnetorheological Finishing Machine for Infrared Imaging [Sep 09, 2026]
[Sep 09, 2026] PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...
Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.
82056. High-Precision Laser Cutter for Thin Metal Fabrication Solutions [Sep 30, 2026]
[Sep 30, 2026] Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal Product Description Product overview: MPS-0606LM is a product specially for the small format precision laser cutting market. It is ...
82057. Versatile CO2 Laser Cutter for Creative DIY Art Projects [Sep 30, 2026]
[Sep 30, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
82058. Advanced Seamless Butyl Adhesive Coating Machine for Precision Applications [Sep 30, 2026]
[Sep 30, 2026] Features •The glue process only melts the top part of the barrel glue and the remaining material remains solid, reducing the influence of thermal stress on the original characteristics ot the glue; •The ...
82059. High Precision Single Mode Fiber Alignment System for Optimal Performance [Sep 30, 2026]
[Sep 30, 2026] Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling efficiency ...
82060. High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic [Sep 30, 2026]
[Sep 30, 2026] High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach ...
82061. High-Precision Pkc300-Q Compact Small-Aperture Optics Magnetorheological Finishing Mrf Machine [Sep 09, 2026]
[Sep 09, 2026] PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...
Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.
82062. High-Speed Die Bonder for Efficient Semiconductor Manufacturing Solutions [Sep 08, 2026]
[Sep 08, 2026] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method ...
82063. Advanced GaN Polishing Tools for High-Quality Sic Wafer Production [Sep 28, 2026]
[Sep 28, 2026] Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other ...
82064. Advanced Precision Laser Engraving Machine for Custom Marking [Sep 28, 2026]
[Sep 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
82065. Advanced High Precision Laser Dicer for IC Glass and Ceramics [Sep 07, 2026]
[Sep 07, 2026] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
