Jiangsu Profile
Product List
14836. Fully Automatic Vacuum Vertical Oven for Semiconductor Drying 
[Oct 30, 2025]
[Oct 30, 2025] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
14837. Advanced Vertical Furnace for Continuous Sic Composite Coating [Oct 30, 2025]
[Oct 30, 2025] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the carbonization ...
14838. Premium Die Attach Bonder for Advanced Semiconductor Packaging Solutions [Oct 30, 2025]
[Oct 30, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond function; Solder patch & solder paste inspection ...
14839. High-Precision Fully Automatic Laser Trimming Machine for Circuit Boards [Oct 30, 2025]
[Oct 30, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...
14840. Precision Cutting and Drilling Machine for Advanced Ceramics [Oct 30, 2025]
[Oct 30, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, cutting ...
14841. Advanced Integrated Patch Solidifying Machine for Precision Bonding [Oct 30, 2025]
[Oct 30, 2025] High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm ...
14842. High-Performance Pss-H160 Seam Welding Equipment for Efficient Production [Oct 30, 2025]
[Oct 30, 2025] Product Description PSS-H160 parallel seam welding machine is a semi-automatic equipment. This device can be used for metal bases and covers Airtight packaging between. This equipment is equipped with a highly reliable ...
14843. High Precision 3W UV Laser Marking Machine for Plastic and Wood [Oct 30, 2025]
[Oct 30, 2025] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, ...
14844. Advanced Fully Automatic UV Laser Marking Machine for PCBA Components [Oct 30, 2025]
[Oct 30, 2025] Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction ...
14845. High Efficiency Die Bonding Machine for Chip Placement [Oct 30, 2025]
[Oct 30, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches (8-inch kit optional) ...
14846. Precision Chip Mounting Equipment for Enhanced Manufacturing Efficiency [Oct 30, 2025]
[Oct 30, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm Applicable resin ...
14847. Precision Eutectic Die Bonder for High-Quality Wafer Manufacturing [Oct 30, 2025]
[Oct 30, 2025] High-Precision Eutectic Machine Wafer Die Bonder Equipment Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size ...
14848. High Precision Flipchip Eutectic Wafer Bonder with Die Attach [Oct 30, 2025]
[Oct 30, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches (8-inch kit optional) ...
14849. Advanced Wafer Mounter for Precision Photonics Packaging Solutions [Oct 30, 2025]
[Oct 30, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm Applicable resin ...
14850. Advanced Semiconductor Chip Turret Loading and Unloading System [Oct 30, 2025]
[Oct 30, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test stations,the ...
