Jiangsu Profile
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Product List
16006. High Precision Fabrication Steel Mould Small Slots Optical Profile Grinding Tie Bar Cut Dies for ... 
[Aug 23, 2024]
[Aug 23, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
16007. Dlc Coating Small Profile Grinding Teeth Carbide Tie Bar Cut Dies for Semiconductor Stamping [Aug 22, 2024]
[Aug 22, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
16008. Long Service High Speed Stamping Profile Grinding Wire Sinker EDM Mould Spare Parts for ... [Aug 20, 2024]
[Aug 20, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
16009. Customized Photo Chemical Etching Stainless Steel and Copper Leadframes for Semiconductors [Jul 24, 2024]
[Jul 24, 2024] Customized Photo Chemical Etching Stainless Steel and Copper leadframes For Semiconductors 1. Photo Etched Plate: Photo Etching is also called metal etching, chemical etching, chemical milling, photo etching, ...
16010. Low Time Consumption Customization Small-Aperture Deterministic Magnetorheological Finishing ... [Sep 09, 2026]
[Sep 09, 2026] PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...
Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.
16011. Intelligent Non-Toxic Customization Small-Aperture Magnetorheological Finishing Machine for ... [Sep 09, 2026]
[Sep 09, 2026] PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...
Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.
16012. High Productivity Customization Small-Aperture Deterministic Magnetorheological Finishing Machine ... [Sep 09, 2026]
[Sep 09, 2026] PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...
Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.
16013. Long Lifespan Energy Saving Custom Small-Aperture Mrf Machine for Semiconductors [Sep 09, 2026]
[Sep 09, 2026] PKC300-Q Five-Axis Magnetorheological Finishing (MRF) Machine Deterministic figure correction for 300 mm-class optics, with support for steep-slope geometries and high-mix production The PKC300-Q combines X/Y/Z linear ...
Company: Apex Ultra-Precision Technology (Nanjing) Co., Ltd.
16014. Smart Industrial Robot for Efficient Semiconductor Packaging Solutions [Sep 22, 2026]
[Sep 22, 2026] Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya ...
16015. Advanced Precision Wire Bonder for Semiconductor Packaging Solutions [Sep 22, 2026]
[Sep 22, 2026] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
16016. Advanced Laser Cutting Technology for Semiconductor Production Excellence [Sep 17, 2026]
[Sep 17, 2026] High Quality Wafer Laser Cutting Equipment Wafer Laser Cutting Machine for Smiconductor Manufacture Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
16017. Precision Laser Trimming Technology for Semiconductor Wafer Processing [Sep 17, 2026]
[Sep 17, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
16018. Customized Semiconductor Insulation Substrate Polished Alumina Al2O3 Ceramic Sheet Wafer [Sep 18, 2026]
[Sep 18, 2026] Product Description Alumina ceramic Alumina ceramic sheet is a flat, high-performance technical ceramic component known for its excellent electrical insulation, hardness, and thermal stability. It serves as a reliable ...
16019. High Purity PVDF Rods for Semiconductor Wafer Carriers [Sep 21, 2026]
[Sep 21, 2026] Product Description Characteristics Item Unit Test method ASTM PVDF Mechanical properties Tensile strength MPa D638 50 Tensile elongation % D638 ≥50 Tensile Modulus Mpa ISO 527-2 2000 Flexural Modulus Mpa ISO 178 2000 ...
16020. Semiconductor Experiments Field Transparent Fused Silica Quartz Glass Wafer Boat [Sep 16, 2026]
[Sep 16, 2026] Product Description High Transmittance Quartz Flow Cell Performance Quartz Flow Cell, Precision Machined Optical Glass Part, Low Defect Transparent Component for Semiconductor & Analytic Testing Silica quartz boat ...
