Jiangsu Profile
Product List
16051. Dust-Free Fast Action Automatic Rapid Roller Shutter Door with Zipper Sealing for Semiconductor ... 
[Oct 24, 2025]
[Oct 24, 2025] Why more and more factories choose SEPPES industrial doors? 1. An industrial Door Brand Exported to Over 50 Countries 2. Serving Over 3600 Clients Worldwide 3. Holder of Multiple Authoritative Certifications, ...
16052. Automatic Flange Hole Punching Machine for Ventilation, Semiconductor and Firefighting Purpose [Aug 19, 2025]
[Aug 19, 2025] Automatic Flange Hole Punching Machine Our high-performance Automatic Flange Hole Punching Machine uses to punch two holes one time on fan flange in one time. It has multi-mode operations, can be manual, semi-automatic ...
Company: Nantong Zhenhuan Trade Co., Ltd.
16053. Black Anodized OEM Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics ... [Aug 14, 2025]
[Aug 14, 2025] Champagne Anodized OEM Aluminum Extrusin Heat Sink Profiles For High Power Semiconductor Electronics Fanless Heatsink Product Description Aluminum heat sink extrusion is the most common process and cost efficient ...
16054. Electrophoresis Anti Scratch Durable Aluminum Extrusion Profiles for High Power Semiconductor ... [Aug 14, 2025]
[Aug 14, 2025] Electrophoresis Anti Scratch Durable Aluminum Extrusion Profiles For High Power Semiconductor Electronics Fanless Heatsink Product Description Aluminum heat sink extrusion is the most common process and cost ...
16055. Custom Precision Optical Profile Grinding Pg Small Slots Tungsten Carbide Dies for Semiconductor ... [Aug 23, 2024]
[Aug 23, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
16056. Manufacturer Precision Mirro-Polished Zirconia Oxide Silicone Nitride Aluminum Ceramic Products for ... [Aug 31, 2023]
[Aug 31, 2023] Company Profile Product Description Content Unit AL2O3 ZrO2 SiC Si3N4 Property 95%AL2O3 99%AL2O3 ZrO2 ZrO2 ZrO2 Mechanical Characteristics Color black faint ...
Company: Wuxi Sundi Precision Tools Co., Ltd
16057. High-Precision Flip Chip Die Bonder for Semiconductor Manufacturing [Aug 31, 2026]
[Aug 31, 2026] High Quality Customized Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Technical Specifications: SHD8120 Die Bonder Parameter Category Specification ...
16058. Superior Laser Cutting Solutions for Precision Semiconductor Fabrication [Aug 27, 2026]
[Aug 27, 2026] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer. ...
16059. Semiconductor Workshop E Type Lift Table [Sep 20, 2026]
[Sep 20, 2026] Semiconductor Workshop E Type Lift Table This stationary E-type scissor lift table is fully constructed of 304 stainless steel. Equipped with E-shaped opening platform, it can dock with pallet truck,tooling ...
16060. Advanced Eutectic Die Bonder for Efficient Semiconductor Assembly [Sep 17, 2026]
[Sep 17, 2026] Product Description Category Sub - Category Parameter Chip Application COC Chip size 0.15mm< Chip size ≤1.5mm Substrate size 0.15mm≤ Substrate size ≤4mm Velocity Production cycle (1 chip) 70s Accuracy Patch pressure ...
16061. Advanced Ultra-Shallow Laser Annealing Systems for Semiconductor Manufacturing [Sep 17, 2026]
[Sep 17, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
16062. PTFE Rod, Anti Static Virgin PTFE Round Bar, for Semiconductor Equipment Fittings [Sep 21, 2026]
[Sep 21, 2026] φ18*100 φ70*100-200 φ20*100 φ77*305 φ25*100 φ75*100-200 φ30*100-300 φ80*100-200 φ35*100-300 φ85*100-200 φ40*150-200 φ90*100-200 φ45*150-200 φ95*100-200 φ50*150-300 φ100*100-200 φ55*150-200 φ110*100-200 Rayhot Technology ...
Company: RH Group of Companies
16063. Non Stick Surface Extruded PTFE Tubing High Purity PTFE Pipe for Semiconductor [Sep 18, 2026]
[Sep 18, 2026] Item Specification Outside diameter(mm) Wall thickness (mm) Length(mm) Pressed Tube 1~25 0.1~2.5 As your requirement Extruded Tube 12.4~213 1.5~15 As your requirement Die Pressed Tube 30~2000 10~500 100~300 Rayhot ...
Company: RH Group of Companies
16064. High Purity PVDF Sheet for Semiconductor Wafer Processing [Sep 16, 2026]
[Sep 16, 2026] Product Description Characteristics Item Unit Test method ASTM PVDF Mechanical properties Tensile strength MPa D638 50 Tensile elongation % D638 ≥50 Tensile Modulus Mpa ISO 527-2 2000 Flexural Modulus Mpa ISO 178 2000 ...
16065. Factory Direct Sales Anti Static Upe Semiconductor Sheet [Sep 16, 2026]
[Sep 16, 2026] Product Description Characteristics Item Unit Test method ASTM UHMW-PE Mechanical properties Tensile strength MPa D638 17 Tensile elongation % D638 ≥50 Tensile Modulus Mpa ISO 527-2 650 Flexural Modulus Mpa ISO 178 800 ...
