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2018 New Arrival Wholesale Superior Quality Semiconductor Electric PTC Ceramic Heater

16411.

2018 New Arrival Wholesale Superior Quality Semiconductor Electric PTC Ceramic Heater Open Details in New Window [Jul 26, 2022]

Product pictures Product details PTC heating element PTC heating element assembled with electrode plates and heat sink fins are dynamic heating element designed to heat up moving air.The large surface area of ...

Company: Yangzhou Tuanrui Electric Co., Ltd.

Semiconductor Machined Plastic Components Polymethylpentene Tpx Insulator

16412.

Semiconductor Machined Plastic Components Polymethylpentene Tpx Insulator Open Details in New Window [Feb 21, 2023]

TPX Polymethylpentene High-precision customized CNC Machining parts insulator for 4G connector 1. Description: TPX™ is a 4-methylpentene-1-based olefin copolymer. TPX™ has a unique molecular ...

Company: Kunshan Dehao Electronic Technology Co., Ltd.

External Rectifier Bridge SKD53/16 Power Semiconductor Module 53A1600V (white inverter bridge pile)

16413.

External Rectifier Bridge SKD53/16 Power Semiconductor Module 53A1600V (white inverter bridge pile) Open Details in New Window [Jun 25, 2022]

Main sales brands of enterprises Including Infineon, Opaque, Japan Sanshe, IXYS Essex, Ximen Kang and Fu. Chevalier, Mitsubishi, Fairchild, New Power Supply, Toshiba, IR, Motorola, Siemens, Ying Da, San IGBT produced ...

Company: Kunshan Qunhao Electric Co., Ltd.

Ceramic Capillary Is Suitable for Semiconductor LED Packing Esp32

16414.

Ceramic Capillary Is Suitable for Semiconductor LED Packing Esp32 Open Details in New Window [Jun 02, 2025]

Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices,ceramic capillary is ...

Company: Shining Point Industrial Co., Limited

What Is Pragmatic Semiconductor Packing Tools Ceramic Capillaries Texas Instrument

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What Is Pragmatic Semiconductor Packing Tools Ceramic Capillaries Texas Instrument Open Details in New Window [May 06, 2025]

What is pragmatic semiconductor packing tools ceramic capillarie Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Ceramic capillary is suitable for ...

Company: Shining Point Industrial Co., Limited

Colored Cleanroom Industry Breathable Mask ESD Anti-Static Shawl Cap for Semiconductor

16416.

Colored Cleanroom Industry Breathable Mask ESD Anti-Static Shawl Cap for Semiconductor Open Details in New Window [Aug 05, 2024]

Colored Cleanroom Industry Breathable Mask ESD Anti-Static Shawl Cap for Semiconductor What service we can provide for our customers: 1. Meet customers' target price by adjust material or other details, ...

Company: LTK Innovations (Suzhou) Trading Inc.

Semiconductor High Precision COB Smart Die Bonding Machine

16417.

Semiconductor High Precision COB Smart Die Bonding Machine Open Details in New Window [Oct 07, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Die Bonding Machine China Manufacturer

16418.

Semiconductor Die Bonding Machine China Manufacturer Open Details in New Window [Sep 27, 2023]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

High End Die Bonder Equipment to Assist in Semiconductor Packaging

16419.

High End Die Bonder Equipment to Assist in Semiconductor Packaging Open Details in New Window [Dec 11, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Bonding Machine

16420.

Bozhon Semiconductor Die Bonding Machine Open Details in New Window [Oct 16, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Attach Epoxy Machine

16421.

Bozhon Semiconductor Die Attach Epoxy Machine Open Details in New Window [Sep 20, 2023]

Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ...

16422.

Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ... Open Details in New Window [Dec 04, 2024]

Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...

Company: Kunshan Chenyun Precision Machinery Co., Ltd.

Aluminum Plate Processing Semiconductor Machine Parts Turning CNC Machining Parts

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Aluminum Plate Processing Semiconductor Machine Parts Turning CNC Machining Parts Open Details in New Window [May 17, 2024]

Company Profile Item name CNC machining Tolerance minimum tolerance 0.005mm Material Titanium,Titanium alloy etc.We handle many other type of materials. Please contact us if your required material is not listed ...

Company: Kunshan Deshengrui Machinery Co., LTD

Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ...

16424.

Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... Open Details in New Window [Jan 25, 2024]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines

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Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines Open Details in New Window [Jan 19, 2024]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd