Jiangsu Profile
Product List
16681. Semiconductor Aluminum Liquid Cold Water Plate Cold Plate Cooling Tec Peltier Cooling 
[Mar 12, 2026]
[Mar 12, 2026] Product description PRODUCT SPECIFICATION FOR WATER COOLING BLOCK NO. ITEM DESCRIPTION CONTENT 1 Material Aluminum alloy like 3003,6061 and 6063 2 Dimension LxWxH Up to 1.2*1m 3 Cooling ...
Company: Nanjing Metalli Industrial Co., Ltd.
16682. Thermoelectric Semiconductor Refrigeration Cooling System Cold Plate Cooler [Mar 12, 2026]
[Mar 12, 2026] Product description PRODUCT SPECIFICATION FOR WATER COOLING BLOCK NO. ITEM DESCRIPTION CONTENT 1 Material Aluminum alloy like 3003,6061 and 6063 2 Dimension LxWxH Up to 1.2*1m 3 Cooling ...
Company: Nanjing Metalli Industrial Co., Ltd.
16683. Precision Ground 6X32mm Diameter 316 Stainless Steel Button Head Semi Tubular Rivet for ... [Mar 08, 2026]
[Mar 08, 2026] Product Description Welcome to Changzhou Wujin Jiangnan Special Type Screw Co., Ltd., a professional semi-tubular rivet manufacturer with years of experience in metal fasteners. We are now expanding to the global market ...
Company: Changzhou Wujin Jiangnan Special Type Screw Co., Ltd.
16684. Industrial Dispensing Automation Robot Used for Semiconductor Packaging/SMT Assembly [Feb 28, 2026]
[Feb 28, 2026] Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya ...
16685. Advanced High-Speed Wire Bonding Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] High-Speed Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant ...
16686. Advanced Customized Flip Chip Die Bonder Machine for Semiconductor Solutions [Feb 28, 2026]
[Feb 28, 2026] High Quality Customized Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Technical Specifications: SHD8120 Die Bonder Parameter Category Specification ...
16687. High-Precision Automatic Die Bonding Equipment for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
16688. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
16689. Fully Automatic IC Transfer Molding Equipment System Semiconductor Plastic Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
16690. Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
16691. High Precision Automatic Die Bonding Machine for Semiconductors [Feb 28, 2026]
[Feb 28, 2026] High Precision Semiconductor manual COB Smart Die Bonding Machine Automatic Dispensing industrial equipment manufacturer Product Description High-Speed Clip Bonder & Die Attach System: A Unified Precision ...
16692. CCD Vision Automatic Alignment Potting Glue Dispensing Machine for LED/Semiconductor [Feb 28, 2026]
[Feb 28, 2026] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing ...
16693. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
16694. 8-Inch SUS420J2 Wafer Dicing Frame for Semiconductor Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
16695. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
