Jiangsu Profile
Product List
16951. Silicon Wafer Edge Processing Machine for Semiconductor Line 
[May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
16952. Semiconductor Wafer Edge Chamfering Machine for IC Yield Control [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
16953. Semiconductor Wafer Cleaning Equipment Reliable Supplier [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Functional Features Bubbling, oscillation, acid washing, alkaline washing, overflow circulation filtration for water saving Technical Highlights ...
16954. Silicon Wafer Grinding Machine for Semiconductor Production Line [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
16955. Semiconductor Wafer Grinding Machine Reliable Supplier [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
16956. Semiconductor Silicon Wafer Grinding Machine Manufacturer China [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
16957. Semiconductor Wafer Polishing Equipment Exporter China [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Variable frequency control enables soft start and soft stop, minimizing impact and workpiece damage. 2. Timer function controls ...
16958. Semiconductor Wafer CMP Machine for IC Fab [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Variable frequency control enables soft start and soft stop, minimizing impact and workpiece damage. 2. Timer function controls ...
16959. 316L Vacuum Air Tight Coil Od6mm*Wt0.8mm High Purity for Semiconductor Gas Pipeline [May 21, 2026]
[May 21, 2026] Product Description Stainless Steel /Aluminum Coiled Tube/ alloy steel / Stainless Steel Coil Pipe We supply high-quality Stainless Steel Coiled Tube and Aluminum Coiled Tube made of premium raw materials. Adopted ...
16960. Picosecond Laser Ultra-Precision Machining System for Semiconductors [Mar 18, 2026]
[Mar 18, 2026] Picosecond laser ultra-precision machining system for semiconductors Product Description 1. Using high-power and high-stability UV laser to directly ablate the gasification material, with a μm-level processing aperture ...
Company: Wuxi Jiuxu Machinery Co., Ltd
16961. Premium Plate Engineering Yellowish-Brown Pai Sheet 4203 Board for Electronics and Semiconductor ... [Mar 13, 2026]
[Mar 13, 2026] Product Description Among PAI series materials, it boasts excellent compressive strength and the highest elongation at break. It also features electrical insulation and outstanding impact strength. Due to its high ...
Company: Changzhou Makewell Industry Co., Ltd
16962. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
16963. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
16964. Advanced High Precision Die Bonder for Semiconductor Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
16965. Semiconductor fab Water-cooled chiller with plant skid solution [Jan 23, 2026]
[Jan 23, 2026] Product Description The SJSW series inherits the hallmark features of American flooded screw chillers: high efficiency, energy savings, superior reliability, and simple, convenient control.Enhanced heat exchange tubes ...
Company: Jiangsu Sujing Group Co., Ltd.
