Jiangsu Profile

Product List
16966. What Is Pragmatic Semiconductor Packing Tools Ceramic Capillaries Texas Instrument
[May 06, 2025]

What is pragmatic semiconductor packing tools ceramic capillarie Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Ceramic capillary is suitable for ...
16967. High Quality Copper Gasket Flange Sealing Gasket
[Jan 08, 2024]

Copper Gasket Size Part ...
16968. Industrial Argon Gas Generator Manufacturer/High-Purity Gas Separation Equipment for Welding & ...
[May 20, 2025]

Product Description Product name Air Separation Plant Technology Cryogenic Brand name Bangwin Oxygen Purity ≥99.6% Oxygen Output 50,80,180,260,350,550,750,1200 Nm3/h Nitrogen ...
16969. Colored Cleanroom Industry Breathable Mask ESD Anti-Static Shawl Cap for Semiconductor
[Aug 05, 2024]

Colored Cleanroom Industry Breathable Mask ESD Anti-Static Shawl Cap for Semiconductor What service we can provide for our customers: 1. Meet customers' target price by adjust material or other details, ...
16970. High Efficiency Psa Nitrogen Generation Unit Complete System High Purity for Industrial ...
[May 20, 2025]

Product Description Purity: 90%-93% Capacity: 200~20000Nm3/h Pressure: Normal 0.4Mpa Energy for Consumption Oxygen:0.36~0.42KWh/Nm The VPSA precess is similar with PSA. VPSA oxygen generator use air ...
16971. Factory Direct Sales 150L/H Liquid Nitrogen Plant PLC Liquid Nitrogen Plant for Manufacturing ...
[May 20, 2025]

Product Description Product name Air Separation Plant Technology Cryogenic Brand name Bangwin Oxygen Purity ≥99.6% Oxygen Output 50,80,180,260,350,550,750,1200 Nm3/h Nitrogen ...
16972. Psa Nitrogen Generation Unit/System 99.999% Purity Integrated Air Compressor Dryer Industrial ...
[May 20, 2025]

Product Description Purity: 90%-93% Capacity: 200~20000Nm3/h Pressure: Normal 0.4Mpa Energy for Consumption Oxygen:0.36~0.42KWh/Nm The VPSA precess is similar with PSA. VPSA oxygen generator use air ...
16973. Semiconductor High Precision COB Smart Die Bonding Machine
[Oct 07, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16974. Semiconductor Die Bonding Machine China Manufacturer
[Sep 27, 2023]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16975. 99.999% Nitrogen Plant 800nm3/H Nitrogen Filling Machine Producing Nitrogen Gas Plant for ...
[May 20, 2025]

Product Description Product name Air Separation Plant Technology Cryogenic Brand name Bangwin Oxygen Purity ≥99.6% Oxygen Output 50,80,180,260,350,550,750,1200 Nm3/h Nitrogen ...
16976. High End Die Bonder Equipment to Assist in Semiconductor Packaging
[Dec 11, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16977. Bozhon Semiconductor Die Bonding Machine
[Oct 16, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16978. Bozhon Semiconductor Die Attach Epoxy Machine
[Sep 20, 2023]

Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16979. Aluminum Plate Processing Semiconductor Machine Parts Turning CNC Machining Parts
[May 17, 2024]

Company Profile Item name CNC machining Tolerance minimum tolerance 0.005mm Material Titanium,Titanium alloy etc.We handle many other type of materials. Please contact us if your required material is not listed ...
16980. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ...
[Jan 25, 2024]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
