Jiangsu Profile
Product List
17326. High Precision Eutectic Machine for Semiconductor Chips 
[Dec 05, 2023]
[Dec 05, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17327. Semiconductor Fully Automatic Optical Testing Equipment [Nov 28, 2023]
[Nov 28, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17328. Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17329. Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17330. Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17331. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17332. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17333. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17334. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17335. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
17336. High Efficiency Psa Nitrogen Generation Unit Complete System High Purity for Industrial ... [May 20, 2025]
[May 20, 2025] Product Description Purity: 90%-93% Capacity: 200~20000Nm3/h Pressure: Normal 0.4Mpa Energy for Consumption Oxygen:0.36~0.42KWh/Nm The VPSA precess is similar with PSA. VPSA oxygen generator use air ...
17337. Factory Direct Sales 150L/H Liquid Nitrogen Plant PLC Liquid Nitrogen Plant for Manufacturing ... [May 20, 2025]
[May 20, 2025] Product Description Product name Air Separation Plant Technology Cryogenic Brand name Bangwin Oxygen Purity ≥99.6% Oxygen Output 50,80,180,260,350,550,750,1200 Nm3/h Nitrogen ...
17338. Carbon Fiber Customized Aerospace Parts Semiconductor Parts Customization [Apr 07, 2025]
[Apr 07, 2025] With an impressive workforce of over 100 skilled internal employees, Suzhou Xuan Xin Technology Co., Ltd proudly boasts an annual output value surpassing 80 million yuan. Equipped with more than 60 state-of-the-art ...
Company: Suzhou Xuan Xin Technology Co., Ltd
17339. Progressive Die Metal Stamping Small Teeth Tungsten Carbide Forming Dambar Punch for Semiconductor ... [Sep 29, 2024]
[Sep 29, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
17340. Mirror Polishing Vacuum Lhj Flanges with Inlet and Outlet Used in Semiconductor [Jun 09, 2025]
[Jun 09, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
