Jiangsu Profile
Product List
18196. PFA Chip Flower Basket Wafer Carrier for Semiconductor Photovoltaics 
[Oct 08, 2023]
[Oct 08, 2023] Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent bottle/stirring ...
18197. PFA Beaker High Temperature Resistant Power Distribution Hot Plate Semiconductor Industry Beaker [Oct 08, 2023]
[Oct 08, 2023] Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent bottle/stirring ...
18198. Daikin PFA Sampling Bottle Cap Semiconductor Acid Storage Bottle Electronic Chemical Industry [Oct 08, 2023]
[Oct 08, 2023] Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent bottle/stirring ...
18199. Medical Semiconductor Transparent PFA Volumetric Flask Can Provide Calibration Service [Oct 08, 2023]
[Oct 08, 2023] Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent bottle/stirring ...
18200. 10nm3/H Pem Stack for Special Gas Production Applys to Semiconductors Manufacturing [Aug 13, 2026]
[Aug 13, 2026] PEM electrolyzer Capable of delivering hydrogen output ranging from 1 to 10Nm3/h, this high-performance electrolyzer can cater to green hydrogen projects of diverse scales. Boasting outstanding energy efficiency, low ...
18201. IC Wafer Thinning Machine for Semiconductor Processing [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18202. Semiconductor Silicon Wafer Grinding Machine for Clean Surface [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18203. Semiconductor Silicon Wafer Thinning Machine High Precision [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18204. Semiconductor Silicon Wafer Double Side Polishing Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18205. Semiconductor Silicon Wafer Thinning Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18206. Semiconductor Wafer Double Side Lapping Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18207. Semiconductor Silicon Wafer Thinning Equipment Supplier [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18208. Semiconductor Silicon Wafer Double Side Grinding Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18209. Semiconductor Silicon Wafer Double Side Grinding Machine CNC [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
18210. Semiconductor Wafer Double Side Polishing Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
