Jiangsu Profile
Product List
18346. Cellulose Free Water Resistant A4 Yellow Laser Printing Paper for Semiconductor 
[Mar 21, 2023]
[Mar 21, 2023] Cellulose Free Water Resistant A4 Yellow Laser Printing Paper For Semiconductor Features: Paper is tough: the paper is standardized and flat, and the thickness is good; Use non-bleeding paper before and ...
Company: Suzhou Jiekon Puri-Tech Co., Ltd.
18347. Customized Clear Fused Silica Square Rectangular Semiconductor Quartz Glass Tubes for Sale [Feb 08, 2023]
[Feb 08, 2023] Product Description Model NO. DH Soft Point 1730 Degree Annealing Point 1210 Degree Thermal Conductivity 1.4W/M.Degree Specific Heat 680j/Kg,Degree Surface Quality 40/60 Shape Can Be Customized Size Can ...
18348. High Temperature Quartz Tube Micro Capillary for Semiconductor [Nov 11, 2022]
[Nov 11, 2022] Product Description Density 2.21×103kg/m3 Hardness 580KHN100 Softening Point 1700ºC Annealing Point 1210 Degree Thermal Conductivity 1.4W/M.Degree Specific Heat 690j/Kg,Degree Compression ...
18349. Semiconductor Wafer Chamfering Machine for IC Chip Manufacturing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
18350. Silicon Wafer Edge Profiling Equipment for Semiconductor Wafer [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
18351. Semiconductor Wafer Chamfering Machine for Clean Room Use [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
18352. IC Wafer Edge Chamfering Equipment for Semiconductor Fab [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
18353. Semiconductor Wafer Double Side Polishing Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
18354. Semiconductor Silicon Wafer Double Side Grinding Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
18355. Semiconductor Wafer Double Side Lapping Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
18356. Semiconductor Silicon Wafer Thinning Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
18357. Semiconductor Silicon Wafer Double Side Grinding Machine CNC [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
18358. Silicon Wafer Thinning Machine for Semiconductor Industry [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
18359. Semiconductor Wafer Double Side Lapping Machine for IC Processing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
18360. Semiconductor Silicon Wafer Double Side Polishing Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
