Jiangsu Profile
Product List
19636. Electronic Device Drilling and Tapping Machine Semiconductor Drilling and Tapping Machinene TV-500 
[Jan 25, 2025]
[Jan 25, 2025] Product Description Basic Info No Name No Name 1 Mitsubishi Japan CNC controller 10 Chip pan and water tank 2 Full cover shroud 11 Transformer 3 Automatic lubricant system 12 Spindle air curtain ...
19637. Quality Assurance SUS Bladed Alumina Oxide Al2O3 Ceramic Parts for Semiconductor Industry [Oct 12, 2024]
[Oct 12, 2024] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
19638. Precision CNC Machining Parts Anodizing Processing Industrial Automation High Hardness ... [Jan 17, 2026]
[Jan 17, 2026] Product Description Circular grinding parts Material Aluminum (6061-T6, 6063, 7075-T6,5052) etc... Brass/Copper/Bronze etc... Stainless Steel (201, 302, 303, 304, 316, 420, 430) etc... Steel (mild steel, Stavax ...
19639. High Quality CNC Machining Aluminum Titanium Stainless Steel Parts Square Grinding Precision Parts ... [Jan 15, 2026]
[Jan 15, 2026] Product Description Square Grinding Parts Material Aluminum (6061-T6, 6063, 7075-T6,5052) etc... Brass/Copper/Bronze etc... Stainless Steel (201, 302, 303, 304, 316, 420, 430) etc... Steel (mild steel, SKH51, ...
19640. CNC OEM Precision Milling Components Machining Parts Titanium Aluminum Stainless Steel Plastic ... [Jan 12, 2026]
[Jan 12, 2026] Product Description CNC Miling Parts Metal Material Aluminum, Stainless Steel, Titanium, Iron, Brass/Copper, Non-metal Machine 3 / 4 /5 axis CNC Machining Center Roughness Ra0.2-Ra3.2 Tolerance 0.005~0.05mm or ...
19641. Customized High Quality Metal Precision CNC Milling Parts Semiconductor Parts CNC Machining Parts [Jan 12, 2026]
[Jan 12, 2026] Product Description CNC Miling Parts Metal Material Aluminum, Stainless Steel, Titanium, Iron, Brass/Copper, Non-metal Machine 3 / 4 /5 axis CNC Machining Center Roughness Ra0.2-Ra3.2 Tolerance 0.005~0.05mm or ...
19642. Custom High Precision Metal Grinding Parts Medical Industry Automotive Mold Parts Semiconductor ... [Jan 06, 2026]
[Jan 06, 2026] Product Description Square Grinding Parts Material Aluminum (6061-T6, 6063, 7075-T6,5052) etc... Brass/Copper/Bronze etc... Stainless Steel (201, 302, 303, 304, 316, 420, 430) etc... Steel (mild steel, SKH51, ...
19643. China High Precision Metal Grinding Parts Medical Industry Mold Parts Automotive Mold Parts, ... [Jan 06, 2026]
[Jan 06, 2026] Product Description Square Grinding Parts Material Aluminum (6061-T6, 6063, 7075-T6,5052) etc... Brass/Copper/Bronze etc... Stainless Steel (201, 302, 303, 304, 316, 420, 430) etc... Steel (mild steel, SKH51, ...
19644. Sinker EDM /Spark Eroded Titanium Coating Tungsten Carbide Mold Dies for Semiconductor [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
19645. Sodick Sebu Wire-Cutting Mirror Surface CNC Machining Mold Part for Semiconductor Industry [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
19646. Semiconductor High Precision COB Smart Die Bonding Machine [Oct 07, 2023]
[Oct 07, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19647. Semiconductor Die Bonding Machine China Manufacturer [Sep 27, 2023]
[Sep 27, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19648. Innomag Pure Liquid Transfer Circuit Board Etching Magnetic Pump for Semiconductor [Oct 15, 2025]
[Oct 15, 2025] Product Introduction Product Brief One-piece metal lined construction designed to resist negative pressure operation. High purity PFA/ETFE liners are suitable for high purity fluids and have excellent corrosion ...
Company: SuZhou GuanYu mechanical and electrical technology Co., LTD
19649. High End Die Bonder Equipment to Assist in Semiconductor Packaging [Dec 11, 2023]
[Dec 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19650. Bozhon Semiconductor Die Bonding Machine [Oct 16, 2023]
[Oct 16, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
