Jiangsu Profile
Product List
19651. Bozhon Semiconductor Die Attach Epoxy Machine 
[Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19652. Innomag U1 Deionised Water Ultrapure Water Cleaning Magnetic Pump for Semiconductor Industry [Oct 15, 2025]
[Oct 15, 2025] Product Introduction Product Brief One-piece metal lined construction designed to resist negative pressure operation. High purity PFA/ETFE liners are suitable for high purity fluids and have excellent corrosion ...
Company: SuZhou GuanYu mechanical and electrical technology Co., LTD
19653. Semiconductor Wafer Carrier95% 99% Alumina Ceramic Disk and Ceramic Edge Ring [Mar 11, 2025]
[Mar 11, 2025] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
19654. Ts16949 Qualified OEM High Precision Parts Turning Milling Custom CNC Machining Service Accessories ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
19655. Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
19656. Custom Made CNC Machining Milling Molding Zro2 Zirconium Oxide Ceramic Parts for Semiconductor ... [Oct 07, 2024]
[Oct 07, 2024] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
19657. High Precision Optical Profile Grinding Opg Progressive Die Metal Stamping Dambar Cutting Die for ... [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
19658. Aluminum Plate Processing Semiconductor Machine Parts Turning CNC Machining Parts [May 17, 2024]
[May 17, 2024] Company Profile Item name CNC machining Tolerance minimum tolerance 0.005mm Material Titanium,Titanium alloy etc.We handle many other type of materials. Please contact us if your required material is not listed ...
19659. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... [Jan 25, 2024]
[Jan 25, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19660. Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19661. Domestic Semiconductor High-Precision Chip Eutectic Machine Supports Gel-Pak Feeding Device [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19662. Integrated Hot Press Bonding Function Semiconductor High-Speed and High-Precision Solidification ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19663. Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19664. Self Developed Motion Control Technology for Domestic High-Precision Semiconductor Solidification ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
19665. Domestic Semiconductor Fully Automatic High-Speed and High-Precision Solidification Machine ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
