Jiangsu Profile
Product List
21736. High-Purity Al2O3 Plate for Semiconductor Applications 
[Sep 29, 2025]
[Sep 29, 2025] Advanced Ceramic Solution for Demanding Industrial and Electronic Applications The Ultra-Pure 99% Alumina Ceramic Plate is a high-performance engineered ceramic component designed for extreme environments where ...
Company: Suzhou Moat City Technology Ltd
21737. Precision-Ground Alumina Ceramic Wafer for Semiconductor Applications [Sep 29, 2025]
[Sep 29, 2025] Advanced Ceramic Solution for Demanding Industrial and Electronic Applications The Ultra-Pure 99% Alumina Ceramic Plate is a high-performance engineered ceramic component designed for extreme environments where ...
Company: Suzhou Moat City Technology Ltd
21738. Ultra-Fine Metallic Catalyst with Nano-Particle Dispersion for Semiconductor Manufacturing [May 19, 2025]
[May 19, 2025] Product Description Metallic Catalyst High-flow metal catalysts are specialized materials vital for chemical reactions, featuring: Composition: Made of metal - based active components, often precious metals on high - ...
Company: Shandong Keyuan Vehicle Catalytic Converter Manufacturing Co., Ltd.
21739. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... [Jan 25, 2024]
[Jan 25, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21740. Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21741. Domestic Semiconductor High-Precision Chip Eutectic Machine Supports Gel-Pak Feeding Device [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21742. Integrated Hot Press Bonding Function Semiconductor High-Speed and High-Precision Solidification ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21743. Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21744. Self Developed Motion Control Technology for Domestic High-Precision Semiconductor Solidification ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21745. Domestic Semiconductor Fully Automatic High-Speed and High-Precision Solidification Machine ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21746. Domestic Star Standard Series Semiconductor Optical 3D Aoi Testing Equipment [Jan 10, 2024]
[Jan 10, 2024] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21747. High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging [Jan 02, 2024]
[Jan 02, 2024] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21748. Semiconductor Leadscan Four Sided Optical Detection Equipment [Dec 11, 2023]
[Dec 11, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21749. High Precision Dispensing Equipment for Semiconductor Packaging Solutions [Dec 06, 2023]
[Dec 06, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21750. Semiconductor High-Precision Die Bonder Machine Made in China [Dec 05, 2023]
[Dec 05, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
