Jiangsu Profile
Product List
28951. High Quality Ion Implanter Semiconductor Material Small Implanter 
[Feb 28, 2026]
[Feb 28, 2026] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
28952. Advanced Precision Oven for Semiconductor Temperature and Humidity Control [Apr 07, 2026]
[Apr 07, 2026] Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
28953. Sic Laser Annealing Semiconductor Equipment Equipped with Efem Transmission System [Apr 02, 2026]
[Apr 02, 2026] Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, compatible with 4, 6, and 8-inch thin chip wafers 2. Integrated self-developed advanced ...
28954. Advanced High Precision Die Bonder for 6" to 8" Semiconductor Manufacturing [Mar 31, 2026]
[Mar 31, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
28955. High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry [Feb 28, 2026]
[Feb 28, 2026] Product Description Wafer Handling and Marking System - Technical Overview Key Features Wafer Compatibility Supports 8-12 inch bare wafers (configurable for 2-12 inches via modular options). Adaptable to ...
28956. China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
28957. High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
28958. Fully Automatic Laser Grooving Equipment for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...
28959. High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device [Feb 28, 2026]
[Feb 28, 2026] Product Description Mainly used in the final process of surface mount semiconductor device production, it can automatically complete the electrical parameter testing, classification and selection storage, laser ...
28960. Fully Automatic Semiconductor Glue Coating and Developing Equipment [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Semiconductor Glue Coating and Developing Equipment Product Description Advanced Semiconductor Coating Systems: Revolutionizing Wafer-Level Manufacturing Efficiency Cutting-Edge Solutions for Next-Gen ...
28961. High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device [Feb 28, 2026]
[Feb 28, 2026] Product Description This machine is equipped with a wafer splitting device for brittle materials such as 2 "~8" LED/SIC/glass/ceramic. The laser processed wafer is supported by the receiving platform as a reference, ...
28962. Advanced Semiconductor Auto Transfer Molding Equipment with Visual System [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
28963. Semiconductor Cleaning Agent Replacement Hcfc-141b Hfo-1233zd Hfo-1336mz Fs-39 Replacement Hcfcs ... [Apr 13, 2026]
[Apr 13, 2026] Specification Product Description Precision Cleaning Solvent: Effectively removes fluorinated lubricants and particulate matter for electronics and medical devices. Lower K-factor Insulation: Superior thermal ...
Company: Chemfine International Co., Ltd.
28964. High-Precision Automatic Die Bonding Machine for Semiconductor Manufacturing [Mar 31, 2026]
[Mar 31, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
28965. High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate [Feb 28, 2026]
[Feb 28, 2026] Product Description Single Machine Plastic Sealing Equipment This single machine plastic sealing equipment is a compact, high-performance solution for semiconductor packaging processes. Designed for manual operation ...
