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4W / 7W / 10W /15W / 25W UV Laser Marking Machine
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6901.

4W / 7W / 10W /15W / 25W UV Laser Marking Machine Open Details in New Window [Sep 01, 2025]

4W / 7W / 10W /15W / 25W UV Laser Marking Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Rongwin CNC Fiber Laser Cutter for Metal Fabrication
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6902.

High-Precision Rongwin CNC Fiber Laser Cutter for Metal Fabrication Open Details in New Window [Aug 29, 2025]

High-Precision RONGWIN CNC Fiber Laser Cutter for Metal Fabrication Product Description Equipped with the most advanced international imported fiber laser source which generates powerful laser focused on objects to ...

Company: Nanjing Rongwin Machinery Technology Co., Ltd.

Customized 99% 99.7% Ceramic Sleeve Aluminum Oxide Al2O3 Insulating Bushing
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6903.

Customized 99% 99.7% Ceramic Sleeve Aluminum Oxide Al2O3 Insulating Bushing Open Details in New Window [Aug 04, 2025]

Alumina ceramic bushing sleeve Product Description Alumina ceramic sleeve are ceramic materials based on alumina (Al2O3) for thick film integrated circuits. Alumina ceramics have good conductivity, mechanical ...

Company: Lianyungang Highborn Technology Co., Ltd.

Fast Work of Intersections, Pedestrian Crossings, Road Lines and Reflective Road Markings ...
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6904.

Fast Work of Intersections, Pedestrian Crossings, Road Lines and Reflective Road Markings ... Open Details in New Window [Apr 02, 2025]

Description: The 860 square box hot melt integrated machine, based on the marking machine, upgrades the furnace and material bucket to simultaneously have the function of hot melt kettle burning, making it easy, ...

Company: Heavsty Transportation Technology (Jiangsu) Co., Ltd.

Precision 1.5kw 3kw 6kw CNC Fiber Laser Cutting Machine for Metal Sheet Metal Plate with Separate ...
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6905.

Precision 1.5kw 3kw 6kw CNC Fiber Laser Cutting Machine for Metal Sheet Metal Plate with Separate ... Open Details in New Window [Sep 13, 2024]

Advanced CNC Machinery of 3000W CNC Fiber Laser Cutting Machine for Precision Sheet Metal and Steel Cutting with Cutting-Edge Laser Equipment Product Description Equipped with the most advanced international ...

Company: Nanjing Rongwin Machinery Technology Co., Ltd.

Best Quality 1500W 2000W 3000W 6000W Metal Sheet CNC Fiber Laser Cutting Machine
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6906.

Best Quality 1500W 2000W 3000W 6000W Metal Sheet CNC Fiber Laser Cutting Machine Open Details in New Window [Mar 20, 2024]

Best Quality 1500W 2000W 3000W 6000W Metal Sheet CNC Fiber Laser Cutting Machine Product Description Equipped with the most advanced international imported fiber laser source which generates powerful laser focused on ...

Company: Nanjing Rongwin Machinery Technology Co., Ltd.

Manufacturer Molding Guide for Texitle Si3n4 Silicon Nitride Zro2 Black Zirconia Oxide Ceramic ...
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6907.

Manufacturer Molding Guide for Texitle Si3n4 Silicon Nitride Zro2 Black Zirconia Oxide Ceramic ... Open Details in New Window [Aug 31, 2023]

Company Profile Product Description Content Unit AL2O3 ZrO2 SiC Si3N4 Property 95%AL2O3 99%AL2O3 ZrO2 ZrO2 ZrO2 Mechanical Characteristics Color ...

Company: Wuxi Sundi Precision Tools Co., Ltd

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing
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6908.

High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing Open Details in New Window [Aug 20, 2025]

Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

CNC Clear Quartz Glass Wafer Transparent Fused Silica Photomask Plate
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6909.

CNC Clear Quartz Glass Wafer Transparent Fused Silica Photomask Plate Open Details in New Window [Aug 20, 2025]

CNC Clear Quartz Glass Wafer Transparent Fused Silica Photomask Plate. Quartz products have the characteristics of high temperature resistance, low coefficient of thermal expansion, acid and alkali resistance and good ...

Company: LIANYUNGANG BAIBO NEW MATERIAL CO., LTD.

Laser Scribing 96% Al2O3 Ceramic Alumina PCB Substrate for Electronic Insulation
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6910.

Laser Scribing 96% Al2O3 Ceramic Alumina PCB Substrate for Electronic Insulation Open Details in New Window [Aug 15, 2025]

Product Description Material Introduction: Aluminium Oxide, Al2O3 is the most widely applied and cost effective technical ceramic material. It offers a combination of superior mechanical strength and electrical ...

Company: Lianyungang Highborn Technology Co., Ltd.

6 to 10 Inch Wafer Laminating Bonding Machine for Semiconductor IC Stacking
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6911.

6 to 10 Inch Wafer Laminating Bonding Machine for Semiconductor IC Stacking Open Details in New Window [Aug 12, 2025]

Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Desktop Metal Glass Plastic Wood UV Laser Marking/Engraving Machine 3W 5W 10W
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6912.

Desktop Metal Glass Plastic Wood UV Laser Marking/Engraving Machine 3W 5W 10W Open Details in New Window [Sep 01, 2025]

Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Price PCBA IC Wafer Automatic Positioning and Marking Equipment
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6913.

Factory Price PCBA IC Wafer Automatic Positioning and Marking Equipment Open Details in New Window [Aug 29, 2025]

Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Loading and Unloading UV Laser 15W Wafer Cutting Machine
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6914.

Automatic Loading and Unloading UV Laser 15W Wafer Cutting Machine Open Details in New Window [Aug 29, 2025]

Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing Features: 1. With 355nm UV laser, the cutting machine has stable performance, good light spot, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry
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6915.

PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry Open Details in New Window [Aug 29, 2025]

PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.