Jiangsu Profile
Product List
6856. Best Quality 1500W 2000W 3000W 6000W Metal Sheet CNC Fiber Laser Cutting Machine 
[Mar 20, 2024]
[Mar 20, 2024] Best Quality 1500W 2000W 3000W 6000W Metal Sheet CNC Fiber Laser Cutting Machine Product Description Equipped with the most advanced international imported fiber laser source which generates powerful laser focused on ...
6857. Manufacturer Molding Guide for Texitle Si3n4 Silicon Nitride Zro2 Black Zirconia Oxide Ceramic ... [Aug 31, 2023]
[Aug 31, 2023] Company Profile Product Description Content Unit AL2O3 ZrO2 SiC Si3N4 Property 95%AL2O3 99%AL2O3 ZrO2 ZrO2 ZrO2 Mechanical Characteristics Color ...
Company: Wuxi Sundi Precision Tools Co., Ltd
6858. High Precision Laser Wafer Dicer Machine for IC Glass Ceramics Semiconductor Dicing [Aug 20, 2025]
[Aug 20, 2025] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
6859. CNC Clear Quartz Glass Wafer Transparent Fused Silica Photomask Plate [Aug 20, 2025]
[Aug 20, 2025] CNC Clear Quartz Glass Wafer Transparent Fused Silica Photomask Plate. Quartz products have the characteristics of high temperature resistance, low coefficient of thermal expansion, acid and alkali resistance and good ...
6860. Laser Scribing 96% Al2O3 Ceramic Alumina PCB Substrate for Electronic Insulation [Aug 15, 2025]
[Aug 15, 2025] Product Description Material Introduction: Aluminium Oxide, Al2O3 is the most widely applied and cost effective technical ceramic material. It offers a combination of superior mechanical strength and electrical ...
6861. 6 to 10 Inch Wafer Laminating Bonding Machine for Semiconductor IC Stacking [Aug 12, 2025]
[Aug 12, 2025] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate ...
6862. Desktop Metal Glass Plastic Wood UV Laser Marking/Engraving Machine 3W 5W 10W [Sep 01, 2025]
[Sep 01, 2025] Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...
6863. Factory Price PCBA IC Wafer Automatic Positioning and Marking Equipment [Aug 29, 2025]
[Aug 29, 2025] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
6864. Automatic Loading and Unloading UV Laser 15W Wafer Cutting Machine [Aug 29, 2025]
[Aug 29, 2025] Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing Features: 1. With 355nm UV laser, the cutting machine has stable performance, good light spot, ...
6865. PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry [Aug 29, 2025]
[Aug 29, 2025] PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the ...
6866. Laser IC Marking Equipment Support Lot End Printing Clearance Function [Aug 27, 2025]
[Aug 27, 2025] Laser IC Marking Equipment Support Lot End Printing Clearance Function Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic ...
6867. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Aug 06, 2025]
[Aug 06, 2025] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
6868. Manual Vacuum Wafer Laminator Mounting Machine for Semiconductor Wafer Thinning [Aug 06, 2025]
[Aug 06, 2025] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate ...
6869. Laser Industry-Leading Laser Wafer Marking for Semiconductor & Mems Manufacturingafer Marking ... [Aug 05, 2025]
[Aug 05, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
6870. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Aug 04, 2025]
[Aug 04, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
