Jiangsu Profile
Product List
13246. SS316 Welded Flanges Ring Parts with High-Pressure Resistance in Semiconductor Vacuum Industry 
[Mar 06, 2025]
[Mar 06, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
13247. Electronical Grade 99.9999% Silane Gas Specialty Gas Sih4 for Semiconductor Industry and Chip ... [Mar 04, 2025]
[Mar 04, 2025] Product Description Essential details CAS No.: Other Names: 7803-62-5 Silane MF: EINECS No.: SiH4 232-263-4 Place of Origin: Grade Standard: Jiangsu, China Industrial Grade, Electron ...
Company: Jiangsu Huazhong Gas Co., Ltd.
13248. Desktop Automatic Glue Dispensing Machine Semiconductor Dispenser Device with Visual Function [Feb 28, 2025]
[Feb 28, 2025] Desktop Automatic Glue Dispensing Machine semiconductor Dispenser device with Visual Function Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
13249. Purity Customize Rectangle Frosty Fused Silica Wafer Quartz Glass Plate for Semiconductor [Feb 28, 2025]
[Feb 28, 2025] Customize Rectangle Frosty Fused Silica wafer Quartz Glass Plate for semiconductor: The adavantage of frosty fused quartz glass plate is not easy to be corroded, can withstand high temperature, beautiful appearance, ...
13250. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Feb 26, 2025]
[Feb 26, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
13251. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
13252. China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports ...
13253. High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
13254. Automatic Die Bonder Qfn Dfn Upload and Down Load Semiconductor Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
13255. High End Die Attach Bonder Equipment to Assist in Semiconductor Packaging [Feb 25, 2025]
[Feb 25, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
13256. High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
13257. Aerospace-Grade Stainless Steel CNC Turning China Spare Parts and Accessories Machining Centre ... [Feb 20, 2025]
[Feb 20, 2025] Product Description Product Processing Type CNC Turning, CNC Milling, Laser Cutting, Bending, Spinning, Wire Cutting, Stamping, Electric Discharge Machining (EDM), Injection Molding Materials Stainless steel: ...
13258. Specializes in The Production of Dust-Free Ovens, Semiconductor Ovens, High-Temperature Ovens, etc. [Feb 18, 2025]
[Feb 18, 2025] Product Description Other Specification Heating mode 26kw 780L × 1 branch Model structure Single door design, the control box is located above the machine Insulation material The use of insulation ...
Company: Kunshan Fanqi Machinery Co., LTD
13259. High Purity Transparent High Temperature Resistance Annealed Quartz Door for Semiconductor [Feb 08, 2025]
[Feb 08, 2025] Product Description high purity transparent high temperature resistance annealed quartz door for semiconductor 1.High purity :SiO2> 99.99%. 2.Operating Temperature: 1250ºC; Soften Temperature: 1730ºC ...
13260. High Temperature Double Frosted Quartz Furnace Door for Photovoltaic Semiconductor [Feb 04, 2025]
[Feb 04, 2025] Product Description high temperature double frosted quartz furnace door for photovoltaic semiconductor 1.High purity :SiO2> 99.99%. 2.Operating Temperature: 1250ºC; Soften Temperature: 1730ºC ...
