Jiangsu Profile
Product List
13651. Portable Transistor Diode Ultrasonic Semiconductor Device Aluminum Gold Desktop Wire Bonder 
[Oct 17, 2025]
[Oct 17, 2025] Product Description Himalaya DS Series Manual Desktop Wire Bonder The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered ...
13652. High Quality Ion Implanter Semiconductor Material Small Implanter [Oct 16, 2025]
[Oct 16, 2025] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the ...
13653. Die Attach Automatic Clip Chip Die Bonder for Semiconductor Packaging and Assembling [Oct 16, 2025]
[Oct 16, 2025] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
13654. Advanced Stealth Dicing Machine Solutions for Semiconductor Wafers [Oct 16, 2025]
[Oct 16, 2025] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. ...
13655. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Oct 16, 2025]
[Oct 16, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
13656. Wire Bonding Machine for Semiconductor Production [Oct 16, 2025]
[Oct 16, 2025] Product Description Maximize Output, Minimize Downtime: The H580PLUS Automatic Wire Bonder The Himalaya H580PLUS is a high-performance, fully automatic, vertical injection molding machine designed for mass production. ...
13657. Advanced Semi-Automatic Eutectic Die Bonder for Semiconductor Applications [Oct 30, 2025]
[Oct 30, 2025] Product Description Category Sub - Category Parameter Chip Application COC Chip size 0.15mm< Chip size ≤1.5mm Substrate size 0.15mm≤ Substrate size ≤4mm Velocity Production cycle (1 chip) 70s Accuracy Patch pressure ...
13658. Fully Automatic Semiconductor High-Precision Die Attach Provide Flexible Packaging Equipment [Oct 30, 2025]
[Oct 30, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
13659. Advanced IGBT Gluing System for High-Performance Semiconductor Equipment Solutions [Oct 30, 2025]
[Oct 30, 2025] Product Description Product name: IGBT Dispensing and Curing Assembly Line Product brand: HOLS Product size: Contact customer service Applicable Industries: Hols Automation Co., Ltd. excels in offering cutting-edge ...
Company: Hols (Suzhou) Automation Co., Ltd.
13660. Anti-Static Brush-Tip Dispensing Needle 2mm Semiconductor Chip Underfill Adhesive [Oct 22, 2025]
[Oct 22, 2025] Product Description Specification item value Machine Type Dispensing Machine warranty Unavailable place of origin China video outgoing-inspection Provided machinery test report Provided brand name SHENGLONG selling ...
Company: Suzhou Shenglong Precision Plastic Hardware Co., Ltd.
13661. Advanced Variable Damping Valve Production Line for Semiconductors [Oct 22, 2025]
[Oct 22, 2025] Product Description CDC Solenoid Valve Assembly Production Line The CDC solenoid valve, also known as the Continuous Damping Control solenoid valve, stands as the cornerstone of a continuous damping control system. This ...
Company: Hols (Suzhou) Automation Co., Ltd.
13662. Advanced Power Semiconductor Potting and Curing Equipment Solutions [Oct 22, 2025]
[Oct 22, 2025] Product Description Product name: IGBT Dispensing and Curing Assembly Line Product brand: HOLS Product size: Contact customer service Applicable Industries: Hols Automation Co., Ltd. stands as a beacon of excellence, ...
Company: Hols (Suzhou) Automation Co., Ltd.
13663. Innovative Electromagnetic Valve Assembly for Advanced Semiconductor Tech [Oct 22, 2025]
[Oct 22, 2025] Product Description CDC Solenoid Valve Assembly Production Line The CDC solenoid valve, known as the Continuous Damping Control solenoid valve, is a pivotal component in advanced damping control systems. This ...
Company: Hols (Suzhou) Automation Co., Ltd.
13664. Advanced IGBT Dispensing Line for Customized Semiconductor Assembly [Oct 22, 2025]
[Oct 22, 2025] Product Description Product Name: IGBT Dispensing and Curing Assembly Line Product Brand: HOLS - Embrace excellence with the HOLS brand, synonymous with innovation and quality in automation solutions. Product Size: ...
Company: Hols (Suzhou) Automation Co., Ltd.
13665. Thermoelectric Semiconductor Refrigeration Cooling System Cold Plate Cooler [Sep 30, 2025]
[Sep 30, 2025] Product description PRODUCT SPECIFICATION FOR WATER COOLING BLOCK NO. ITEM DESCRIPTION CONTENT 1 Material Aluminum alloy like 3003,6061 and 6063 2 Dimension LxWxH Up to 1.2*1m 3 Cooling ...
Company: Nanjing Metalli Industrial Co., Ltd.
