Jiangsu Profile

Product List
13906. Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach
[Aug 14, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
13907. Dual Dispensing System Die Bonder Die Bonding Machine for Semiconductor Industry
[Aug 14, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
13908. Harmonic Precision Reducer for Semiconductor Equipment or Machine Tools
[Sep 02, 2025]

Unlock the future of precision with our Manufacturer Direct Sales High Precision Harmonic Drive. Dive deep into the world of unparalleled technology with extensive details and a meticulously crafted selection manual. ...
Company: Wuxi Hemingder Technology Co., Ltd
13909. Semiconductor Equipment Die Bonding Machine Fully Automatic Die Bonder for SIP/BGA/LGA/Qfn
[Aug 12, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
13910. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
[Aug 12, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
13911. Automatic Equipments /Automatic Production Lines (for 3C electronics, photovoltaics, lithium ...
[Sep 02, 2025]

Product Description 1. Used for automatic mounting of components related to D parts of computer casings; Like foam Mylar, Copper foil, foot pads, etc; 2. The product mounting is completed by a four axis parallel ...
Company: Suzhou Yishihan Electromechanical Technology Co., Ltd.
13912. Versatile Automatic Laminator System for Semiconductor Industry Needs
[Aug 12, 2025]

Product Description Certification ISO Warranty 1 year Automatic Grade Automatic Installation Vertical Driven Type Electricity + Pneumatic Function Automatical Production Automatic substrate laminating ...
13913. China Factory High Purity Semiconductor Gas Electronic Gas 99.9999% 6n Grade Sih4 Gas Silane
[Aug 11, 2025]

Product Description Essential details CAS No.: Other Names: 7803-62-5 Silane MF: EINECS No.: SiH4 232-263-4 Place of Origin: Grade Standard: Jiangsu, China Industrial Grade, Electron ...
Company: Jiangsu Huazhong Gas Co., Ltd.
13914. Precision CNC Machined Steel Parts for Semiconductor Equipment
[Aug 04, 2025]

Product Description CNC MACHINING SERVICE High Precision Machining Capabilities: Unlock the extraordinary potential of your projects with Suzhou Provence Precision Manufacturing Co., Ltd.'s elite custom CNC parts ...
13915. Precision CNC Machining Alloy Steel Parts for Semiconductors
[Aug 04, 2025]

Product Description CNC MACHINING SERVICE High Precision Machining Capabilities: Unleash the full potential of your projects with our exceptional custom CNC parts machining service. Harness our advanced high-tech ...
13916. Precision Vacuum Diffusion Bonding Furnace for Semiconductor Industry
[Aug 02, 2025]

Product Description This standard vacuum brazing and diffusion welding furnace is primarily designed for high-precision diffusion processes such as bonding of turbine blades, missile warheads, fuses, and other ...
13917. Precision CNC Machined Metal Parts for Semiconductors and Electronics
[Aug 01, 2025]

Product Description CNC MACHINING SERVICE High Precision Machining Capabilities: Unlock the full potential of your projects with the unparalleled excellence of our custom CNC parts machining service. Elevate your ...
13918. Custom CNC Machined Parts for Semiconductor Manufacturing Solutions
[Aug 01, 2025]

Product Description CNC MACHINING SERVICE High Precision Machining Capabilities: Unlock unparalleled potential for your projects with our elite custom CNC parts machining service. Harness the power of our ...
13919. High Efficiency Gold Copper Wire Bonding Machine for Semiconductor Equipment IC Packaging and ...
[Jul 30, 2025]

Product Description Discover the H580PLUS High-Speed Fully Automatic Wire Bonder, designed for semiconductor packaging professionals who need speed, accuracy, and flexibility. With advanced vision technology and the ...
13920. Advanced High Precision Iron Aluminum Stainless Steel ...
[Jul 26, 2025]

Suzhou VTA Precision Manufacturing Co.,Ltd Suzhou VTA is a professional CNC machining precision parts processing factory. 20+ Years industry experience, 2000+ square met ers factory area, we offer CNC machinery parts, ...
