Jiangsu Profile
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Product List
14431. Manufacturer Precision Mirro-Polished Zirconia Oxide Silicone Nitride Aluminum Ceramic Products for ... 
[Aug 31, 2023]
[Aug 31, 2023] Company Profile Product Description Content Unit AL2O3 ZrO2 SiC Si3N4 Property 95%AL2O3 99%AL2O3 ZrO2 ZrO2 ZrO2 Mechanical Characteristics Color black faint ...
Company: Wuxi Sundi Precision Tools Co., Ltd
14432. Custom Laminator Solution Tailored for Semiconductor Industry Needs [Mar 16, 2026]
[Mar 16, 2026] Product Description Manual Film Laminator Series Product Description Product Overview This manual film laminator series is engineered for fast and efficient application of protective film onto wafers, glass, ...
14433. High Precision Aluminum Sheet Stainless Steel Plate for Semiconductor Equipment [Mar 12, 2026]
[Mar 12, 2026] Product Description Product Stainless Stee Plate Surface Finish BA, 2B, 2D, 4K, 6K, 8K, NO.4, HL, Embossed Technique Hot Rolled / Cold Rolled Standard GB JIS ASTM ASME EN Steel Grade 200 series: 201 202 300 series: 301 ...
14434. Advanced High-Speed Die Bonder for Efficient Semiconductor Production [Mar 10, 2026]
[Mar 10, 2026] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method ...
14435. Advanced Laser Cutting System for Precision Semiconductor Wafers [Mar 10, 2026]
[Mar 10, 2026] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
14436. Great Quality Semiconductor Specialty Gas Silane Sih4 Gas [Mar 05, 2026]
[Mar 05, 2026] Product Description Essential details CAS No.: Other Names: 7803-62-5 Silane MF: EINECS No.: SiH4 232-263-4 Place of Origin: Grade Standard: Jiangsu, China Industrial Grade, Electron ...
Company: Jiangsu Huazhong Gas Co., Ltd.
14437. High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips [Feb 28, 2026]
[Feb 28, 2026] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
14438. Industrial Dispensing Automation Robot Used for Semiconductor Packaging/SMT Assembly [Feb 28, 2026]
[Feb 28, 2026] Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya ...
14439. Advanced High-Speed Wire Bonding Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] High-Speed Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase ...
14440. Advanced Customized Flip Chip Die Bonder Machine for Semiconductor Solutions [Feb 28, 2026]
[Feb 28, 2026] High Quality Customized Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Technical Specifications: SHD8120 Die Bonder Parameter Category Specification ...
14441. High-Precision Automatic Die Bonding Equipment for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
14442. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
14443. Fully Automatic IC Transfer Molding Equipment System Semiconductor Plastic Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
14444. Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
14445. Advanced Efficiency Bonder for Precision Semiconductor Wire Bonder Packaging Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
