Jiangsu Profile
Famous Export Brand
Product List
21106. High Precision 3W UV Laser Engraver for Wood and Plastic Projects 
[Mar 02, 2026]
[Mar 02, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
21107. High-Precision UV Laser Marking System for PCBA Components [Mar 02, 2026]
[Mar 02, 2026] Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser ...
21108. Precision Laser Engraving Machines for Home Appliance Customization [Mar 02, 2026]
[Mar 02, 2026] Automatic Focusing PCBA Laser Marking Machine for Household Appliances/Office Equipment Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other ...
21109. Precision Laser Trimming Technology for Optimal PCB Manufacturing Efficiency [Mar 02, 2026]
[Mar 02, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...
21110. School Lab Bench Lab Furniture at Site Offering 3D Free Drawing Jh-Wf015 [Mar 02, 2026]
[Mar 02, 2026] 3D design for 6 chemical school labs in Africa 3D design for 6 physics school labs Type: JH-WF015 The size and colour can be custom-made requested by customers. A. Metal frame: It's made of 60*40*2.0mm ...
21111. Precision Fiber Laser Cutting Machine for High-Performance Fabrication [Feb 28, 2026]
[Feb 28, 2026] High Configuration/High-Performance Fiber Laser Cutting Machine Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting ...
21112. Advanced Precision Eutectic Die Bonder for Wafer Production [Feb 28, 2026]
[Feb 28, 2026] High-Precision Eutectic Machine Wafer Die Bonder Equipment Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F ...
21113. Semiconductor Equipment Wafer Loading and Unloading Wafer Mounter Dicing Turret Handler [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
21114. High-Speed Precision Glue Dispensing Machine for SMT Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description 1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display 2. CCD visual positioning system 3. Adopt linear motor + motion control card 4. Modular ...
21115. High-Precision UV Laser Cutter for Mobile Device Components [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
21116. Advanced CCD Vision Silicone Dispensing System for Precision Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...
21117. High-Precision 355nm UV Laser Cutter for Semiconductor Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing Features: 1. With 355nm UV laser, the cutting machine has stable performance, good light ...
21118. Precision Cutting and Trenching Machine for Fpcba and PCBA [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
21119. Advanced Fully Automatic Wafer ID Marking Machine for Semiconductor Materials [Feb 28, 2026]
[Feb 28, 2026] Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional linear motor platform, DD motor wafer dual arm handling robot, fully automatic visual ...
21120. Advanced Fully Automatic Vertical Vacuum Oven for Semiconductor Drying [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
