Jiangsu Profile
Product List
21151. High-Precision Strip Laser Marking Machine with Offline Control 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Dual laser head marking Automatic loading and unloading Various templates for marking, online monitoring of marking quality Offline control mode ensures stability and printing ...
21152. Advanced Fiber Laser Cutting Machine with Dual Drive Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...
21153. High-Precision UV Laser Engraving Machine for Glass Masterpieces [Feb 28, 2026]
[Feb 28, 2026] UV Laser Engraving Machine for Glass Surface Marking Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging ...
21154. High-Precision 20W Desktop Metal Laser Engraver for Art Projects [Feb 28, 2026]
[Feb 28, 2026] 20W Desktop Air Cooling Metal Laser Engraving Machine Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high ...
21155. Advanced Horizontal and Vertical Oxidation Diffusion Systems for Industrial Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Small Batch/R&D Oxidation Diffusion System This compact oxidation diffusion system is specifically engineered for research and development and small batch production in advanced semiconductor and ...
21156. High-Performance Dqx Series RF Plasma Cleaner for Precision Applications [Feb 28, 2026]
[Feb 28, 2026] Dqx Series Radio Frequency Plasma Cleaning Machine Product Description The principle of plasma cleaning is to from high frequency alternating electrodes in vacuum condition, so that the gas in this area will from ...
21157. Sustainable Wastewater Solutions Tailored for Food Processing Needs [Feb 28, 2026]
[Feb 28, 2026] Product Description 1. Scope of application The mass fraction of salt content in wastewater is 3.5%-25%; the multi effect evaporator is suitable for material crystallization temperature at 45-80 C and evaporation less ...
21158. Advanced Precision Fiber Laser Cutting Machine for Metal Sheets [Feb 28, 2026]
[Feb 28, 2026] Interactive Optical Fiber Laser Cutting Machine for Sheet Metal Processing Industry Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive ...
21159. High-Precision Air Cooling CO2 Laser Marking Machine for Diverse Materials [Feb 28, 2026]
[Feb 28, 2026] Product Description It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and ...
21160. High-Power 30W CO2 Laser Engraving Machine for Diverse Materials [Feb 28, 2026]
[Feb 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
21161. High Precision CCD Automatic Glue Dispensing Machine for Digital Components [Feb 28, 2026]
[Feb 28, 2026] Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...
21162. Advanced Fully Automatic Pre-Lamination and Encapsulation System for Industry [Feb 28, 2026]
[Feb 28, 2026] Features •Complete the processes of short-side butyl adhesive, short-side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and ...
21163. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high ...
21164. Advanced High Precision Eutectic Wafer Bonder for Die Attachment [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
21165. High-Precision Ceramic Cutting and Drilling Machine for Professionals [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
