Jiangsu Profile
Famous Export Brand
Product List
21136. High-Precision Air Cooling CO2 Laser Marking Machine for Diverse Materials 
[Feb 28, 2026]
[Feb 28, 2026] Product Description It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and ...
21137. High-Power 30W CO2 Laser Engraving Machine for Diverse Materials [Feb 28, 2026]
[Feb 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
21138. High Precision CCD Automatic Glue Dispensing Machine for Digital Components [Feb 28, 2026]
[Feb 28, 2026] Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...
21139. Advanced Fully Automatic Pre-Lamination and Encapsulation System for Industry [Feb 28, 2026]
[Feb 28, 2026] Features •Complete the processes of short-side butyl adhesive, short-side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and ...
21140. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high ...
21141. Advanced High Precision Eutectic Wafer Bonder for Die Attachment [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
21142. High-Precision Ceramic Cutting and Drilling Machine for Professionals [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
21143. Versatile Kiln for Advanced Ceramic Fiber and High Heat [Feb 28, 2026]
[Feb 28, 2026] Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...
21144. Advanced Laser Epitaxy System for High-Quality Material Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic 12 inch mass production equipment High precise beam combination technology and modulation technology for Multi- laser Rectangular Top-hat beam with large size, ...
21145. High-Precision Laser Engraving Machine for Metal and Plastic [Feb 28, 2026]
[Feb 28, 2026] Laser Marking Machine/Engraver on Metal and Non Metal Materials Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine ...
21146. Advanced High-Precision Fiber Laser Cutting Machine for Metals [Feb 28, 2026]
[Feb 28, 2026] Fiber Laser Cutting Machine for Various Alloy Materials Pipe Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine ...
21147. Advanced Laser Cutting Machine for Precision Sheet Fabrication [Feb 28, 2026]
[Feb 28, 2026] High Precision Laser Cutting Equipment for Slicing/Cutting /Drilling of High-Precision Sheets Product Description Product overview: mps-0303lp fiber laser cutting machine adopts high-performance linear motor, ...
21148. 20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry [Feb 28, 2026]
[Feb 28, 2026] 20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, ...
21149. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
21150. Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...
