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Advanced Fully Automatic Pre-Lamination and Encapsulation System for Industry
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21166.

Advanced Fully Automatic Pre-Lamination and Encapsulation System for Industry Open Details in New Window [Feb 28, 2026]

Features •Complete the processes of short-side butyl adhesive, short-side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Djj-120 Automatic Chamfering Machine for Semiconductor Wafer
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21167.

Djj-120 Automatic Chamfering Machine for Semiconductor Wafer Open Details in New Window [Feb 28, 2026]

Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High Precision Eutectic Wafer Bonder for Die Attachment
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21168.

Advanced High Precision Eutectic Wafer Bonder for Die Attachment Open Details in New Window [Feb 28, 2026]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Ceramic Cutting and Drilling Machine for Professionals
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21169.

High-Precision Ceramic Cutting and Drilling Machine for Professionals Open Details in New Window [Feb 28, 2026]

Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Versatile Kiln for Advanced Ceramic Fiber and High Heat
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21170.

Versatile Kiln for Advanced Ceramic Fiber and High Heat Open Details in New Window [Feb 28, 2026]

Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Epitaxy System for High-Quality Material Production
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21171.

Advanced Laser Epitaxy System for High-Quality Material Production Open Details in New Window [Feb 28, 2026]

Product Description Product Features First domestic 12 inch mass production equipment High precise beam combination technology and modulation technology for Multi- laser Rectangular Top-hat beam with large size, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Engraving Machine for Metal and Plastic
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21172.

High-Precision Laser Engraving Machine for Metal and Plastic Open Details in New Window [Feb 28, 2026]

Laser Marking Machine/Engraver on Metal and Non Metal Materials Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High-Precision Fiber Laser Cutting Machine for Metals
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21173.

Advanced High-Precision Fiber Laser Cutting Machine for Metals Open Details in New Window [Feb 28, 2026]

Fiber Laser Cutting Machine for Various Alloy Materials Pipe Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Cutting Machine for Precision Sheet Fabrication
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21174.

Advanced Laser Cutting Machine for Precision Sheet Fabrication Open Details in New Window [Feb 28, 2026]

High Precision Laser Cutting Equipment for Slicing/Cutting /Drilling of High-Precision Sheets Product Description Product overview: mps-0303lp fiber laser cutting machine adopts high-performance linear motor, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry
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21175.

20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry Open Details in New Window [Feb 28, 2026]

20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China
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21176.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China Open Details in New Window [Feb 28, 2026]

Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace
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21177.

Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace Open Details in New Window [Feb 28, 2026]

Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Premium Alkaline Polishing Equipment for Ultimate Cleaning Solutions
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21178.

Premium Alkaline Polishing Equipment for Ultimate Cleaning Solutions Open Details in New Window [Feb 28, 2026]

Product Description Key Features & Benefits: 1. High Throughput & Scalability Processes 6 baskets in parallel, significantly reducing cycle time for batch production. Modular design allows integration into ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Rubber Discharge Oven for Metal Carrier Processing
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21179.

Advanced Rubber Discharge Oven for Metal Carrier Processing Open Details in New Window [Feb 28, 2026]

Product Description The mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality 220kg/M3 Refractory Insulation Calcium Silicate Board for Furnace Refractory
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21180.

High Quality 220kg/M3 Refractory Insulation Calcium Silicate Board for Furnace Refractory Open Details in New Window [Feb 27, 2026]

High Quality 220kg/m3 Refractory Insulation Calcium Silicate Board for Furnace Refractory Product Description KT Non-asbestos microporous calcium silicate is a new type of white hard thermal insulation material, it ...

Company: Kaowoo Thermal Insulation Co., Ltd