Jiangsu Profile
Product List
16546. Ti Target Titanium Sputtering Target / Titanium Rotary Target for Semiconductor /Vacuum Coating ... 
[May 28, 2026]
[May 28, 2026] Product Description Name Ti Target Material Titanium Purity 99.9~99.999% Size Customized Color Silver Shape Customized Surface Polished ...
16547. Xxt19 Galden Ht170 Perfluoropolyether Oil High Temp & Corrosion Resistant for Semiconductor & ... [Apr 27, 2026]
[Apr 27, 2026] Product Description Brand Solvay Model HT170 Type Perfluoropolyether Oil Specification 5kg/barrel Features Wear-resistant / High-temperature resistant / Corrosion-resistant / High-pressure resistant / High-vacuum ...
Company: Jingjiang E-Asia Bearing Co., Ltd.
16548. Fused Silica Sand White Micron Powder 99.9% for Semiconductor Wafer [Apr 01, 2026]
[Apr 01, 2026] Company Profile Runlai Quartz Technology Since: 2018 Specialty: Mainly engaged in fire-resistant and wear-resistant materials such as fused quartz, quartz sand and quartz products. Capacity: 10,000 dresses/month ...
16549. Fused Silica Micron Powder 99.9% 800 Mesh for Semiconductor Industry [Apr 01, 2026]
[Apr 01, 2026] Company Profile Runlai Quartz Technology Since: 2018 Specialty: Mainly engaged in fire-resistant and wear-resistant materials such as fused quartz, quartz sand and quartz products. Capacity: 10,000 dresses/month ...
16550. Fused Silica Powder 99.9% 800 Mesh Ultra-Fine for Semiconductor [Apr 01, 2026]
[Apr 01, 2026] Company Profile Runlai Quartz Technology Since: 2018 Specialty: Mainly engaged in fire-resistant and wear-resistant materials such as fused quartz, quartz sand and quartz products. Capacity: 10,000 dresses/month ...
16551. 99.99% High Purity Fused Silica Powder Ultra Fine for Semiconductor [Apr 01, 2026]
[Apr 01, 2026] Company Profile Runlai Quartz Technology Since: 2018 Specialty: Mainly engaged in fire-resistant and wear-resistant materials such as fused quartz, quartz sand and quartz products. Capacity: 10,000 dresses/month ...
16552. Fused Silica Powder / Fused Quartz Powder for Investment Casting Semiconductor [Apr 01, 2026]
[Apr 01, 2026] Company Profile Runlai Quartz Technology Since: 2018 Specialty: Mainly engaged in fire-resistant and wear-resistant materials such as fused quartz, quartz sand and quartz products. Capacity: 10,000 dresses/month ...
16553. High Precision Aluminum Sheet Stainless Steel Plate for Semiconductor Equipment [Mar 12, 2026]
[Mar 12, 2026] Product Description Product Stainless Stee Plate Surface Finish BA, 2B, 2D, 4K, 6K, 8K, NO.4, HL, Embossed Technique Hot Rolled / Cold Rolled Standard GB JIS ASTM ASME EN Steel Grade 200 series: 201 202 300 series: 301 ...
16554. Great Quality Semiconductor Specialty Gas Silane Sih4 Gas [Mar 05, 2026]
[Mar 05, 2026] Product Description Essential details CAS No.: Other Names: 7803-62-5 Silane MF: EINECS No.: SiH4 232-263-4 Place of Origin: Grade Standard: Jiangsu, China Industrial Grade, Electron ...
Company: Jiangsu Huazhong Gas Co., Ltd.
16555. Advanced High-Speed Wire Bonding Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] High-Speed Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant ...
16556. Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
16557. High Precision Automatic Die Bonding Machine for Semiconductors [Feb 28, 2026]
[Feb 28, 2026] High Precision Semiconductor manual COB Smart Die Bonding Machine Automatic Dispensing industrial equipment manufacturer Product Description High-Speed Clip Bonder & Die Attach System: A Unified Precision ...
16558. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
16559. 8-Inch SUS420J2 Wafer Dicing Frame for Semiconductor Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
16560. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
