Jiangsu Profile
Product List
16486. Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging 
[Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16487. Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16488. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16489. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16490. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16491. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16492. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16493. Factory Customized Aluminum Parts Medical Semiconductor Parts Automation Turning and Milling ... [Dec 11, 2023]
[Dec 11, 2023] Our Advantages UE(user experience) Certifications CNC machining has entered this era of rapid development, many industries can use CNC machining, such as aviation, medical, automobile, motorcycle, ...
16494. Precision Turned-Milling Machining OEM/ODM Small CNC Turning Milling Parts for Swiss ... [Feb 26, 2024]
[Feb 26, 2024] Model NO. Custom Parts Application Fastener, Auto and Motorcycle Accessories, Hardware Tool, Machinery Accessory Standard GB, EN, China GB Code, JIS Code, TEMA, ASME Surface Treatment Anodizing Production ...
16495. Advanced Semiconductor Chip Sorting Machine for Efficient Factories [Feb 10, 2025]
[Feb 10, 2025] Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast ...
16496. Advanced Semiconductor Chip Sorting System for Efficient Production [Feb 10, 2025]
[Feb 10, 2025] Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast ...
16497. High Precision Chip Sorting Machine for Semiconductor Industry [Jan 22, 2025]
[Jan 22, 2025] Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast ...
16498. High-Efficiency BGA and Qfn Semiconductor Chip Sorting Machine [Jan 07, 2025]
[Jan 07, 2025] Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast ...
16499. High-Efficiency ODM Semiconductor Chip Sorting System for Precision [Dec 26, 2024]
[Dec 26, 2024] Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast ...
16500. Advanced Windows 10 Semiconductor Chip Sorting Machine with Jedec Tray [Dec 26, 2024]
[Dec 26, 2024] Product Description Chip Intelligent Sorting Machine is developed for automatic loading,unloading and sorting chips. The design objective of this equipment is to replace manual operations with automation, enabling fast ...
