Jiangsu Profile
Product List
21631. Bozhon Semiconductor Die Bonding Machine 
[Oct 16, 2023]
[Oct 16, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21632. Bozhon Semiconductor Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21633. Semiconductor Assurance Air Cooled Water Cooled Chiller Refrigeration Cycle with Manufacture [Mar 12, 2020]
[Mar 12, 2020] Main product parameters of industrial water chiller: The parameters in the table are standard data. We support custom services Main product accessories: Application Wuxi Guanya Refrigeration ...
Company: Lneya Thermo Refrigeration Co., Ltd.
21634. 10L Low-Temperature Semiconductor Cooling Centrifugal Water Cooled Chiller Plant 250 Ton [Mar 06, 2020]
[Mar 06, 2020] Main product parameters of industrial water chiller: The parameters in the table are standard data. We support custom services Main product accessories: Application Wuxi Guanya Refrigeration ...
Company: Lneya Thermo Refrigeration Co., Ltd.
21635. Transparent High Temperature Resistant Semiconductor Quartz Tube [Oct 25, 2019]
[Oct 25, 2019] Natural Quartz glass Tube Characteristic : Customization: Queen Quartz provides the service to customize the product according to customer's requirement, including cutting, end burning, grinding, special-shaping and ...
Company: LIANYUNGANG QUEEN INTL CO., LTD.
21636. High-Purity Al2O3 Plate for Semiconductor Applications [Sep 29, 2025]
[Sep 29, 2025] Advanced Ceramic Solution for Demanding Industrial and Electronic Applications The Ultra-Pure 99% Alumina Ceramic Plate is a high-performance engineered ceramic component designed for extreme environments where ...
Company: Suzhou Moat City Technology Ltd
21637. Precision-Ground Alumina Ceramic Wafer for Semiconductor Applications [Sep 29, 2025]
[Sep 29, 2025] Advanced Ceramic Solution for Demanding Industrial and Electronic Applications The Ultra-Pure 99% Alumina Ceramic Plate is a high-performance engineered ceramic component designed for extreme environments where ...
Company: Suzhou Moat City Technology Ltd
21638. Ultra-Fine Metallic Catalyst with Nano-Particle Dispersion for Semiconductor Manufacturing [May 19, 2025]
[May 19, 2025] Product Description Metallic Catalyst High-flow metal catalysts are specialized materials vital for chemical reactions, featuring: Composition: Made of metal - based active components, often precious metals on high - ...
Company: Shandong Keyuan Vehicle Catalytic Converter Manufacturing Co., Ltd.
21639. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... [Jan 25, 2024]
[Jan 25, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21640. Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21641. Domestic Semiconductor High-Precision Chip Eutectic Machine Supports Gel-Pak Feeding Device [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21642. Integrated Hot Press Bonding Function Semiconductor High-Speed and High-Precision Solidification ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21643. Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21644. Self Developed Motion Control Technology for Domestic High-Precision Semiconductor Solidification ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21645. Domestic Semiconductor Fully Automatic High-Speed and High-Precision Solidification Machine ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
