Jiangsu Profile
Product List
21646. Domestic Star Standard Series Semiconductor Optical 3D Aoi Testing Equipment 
[Jan 10, 2024]
[Jan 10, 2024] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21647. High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging [Jan 02, 2024]
[Jan 02, 2024] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21648. Semiconductor Leadscan Four Sided Optical Detection Equipment [Dec 11, 2023]
[Dec 11, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21649. High Precision Dispensing Equipment for Semiconductor Packaging Solutions [Dec 06, 2023]
[Dec 06, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21650. Semiconductor High-Precision Die Bonder Machine Made in China [Dec 05, 2023]
[Dec 05, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21651. High Precision Eutectic Machine for Semiconductor Chips [Dec 05, 2023]
[Dec 05, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21652. Semiconductor Fully Automatic Optical Testing Equipment [Nov 28, 2023]
[Nov 28, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21653. Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21654. Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21655. Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21656. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21657. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21658. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21659. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21660. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
