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Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging

22111.

Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging

22112.

Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment

22113.

Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Chip Placement Equipment High-Precision Dispensing Machine

22114.

Semiconductor Chip Placement Equipment High-Precision Dispensing Machine Open Details in New Window [Nov 22, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Power Semiconductor High-Precision Die Bonding Equipment

22115.

Power Semiconductor High-Precision Die Bonding Equipment Open Details in New Window [Nov 20, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Back-End Packaging and Bonding Placement Equipment

22116.

Semiconductor Back-End Packaging and Bonding Placement Equipment Open Details in New Window [Nov 17, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Bonding Machine China Equipment

22117.

Bozhon Semiconductor Die Bonding Machine China Equipment Open Details in New Window [Oct 09, 2023]

Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Submikron Semiconductor Die Bonding & Die Solder Machines

22118.

Submikron Semiconductor Die Bonding & Die Solder Machines Open Details in New Window [Oct 09, 2023]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Electronic Grade Pneumatic Diaphragm PTFE Membrane Pump for Semiconductor PCB High Purity / ...

22119.

Electronic Grade Pneumatic Diaphragm PTFE Membrane Pump for Semiconductor PCB High Purity / ... Open Details in New Window [Mar 11, 2026]

HCMAG Product Introduction Electronic grade pneumatic diaphragm pump introduction E-Series air operated double diaphragm pumps are equipped with diaphragms made of NBR, EPDM, PTFE, etc., depending on the fluid ...

Company: SuZhou GuanYu mechanical and electrical technology Co., LTD

No Bubble Quartz Glass Rod for Semiconductor Quartz Bar

22120.

No Bubble Quartz Glass Rod for Semiconductor Quartz Bar Open Details in New Window [Oct 18, 2025]

Product Description Product Name no bubble quartz glass rod for semiconductor quartz bar Color Clear Application 1.Laboratory equipment, 2.Optoelectronic communications 3.Chemistry, Machinery, Electric power, ...

Company: Lianyungang Telling Quartz Co., Ltd.

Stainless Steel Aluminium Alloy Semiconductor Cooler Parts Liquid Cold Plate Heat Exchanger

22121.

Stainless Steel Aluminium Alloy Semiconductor Cooler Parts Liquid Cold Plate Heat Exchanger Open Details in New Window [Jul 17, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

Stainless Steel Alloy Precision Semiconductor Cooler Parts Customization Plate Heat Exchanger

22122.

Stainless Steel Alloy Precision Semiconductor Cooler Parts Customization Plate Heat Exchanger Open Details in New Window [Jul 17, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

SUS316 Precision Parts Customization Plate Cooler Heat Exchanger for Semiconductor Industry

22123.

SUS316 Precision Parts Customization Plate Cooler Heat Exchanger for Semiconductor Industry Open Details in New Window [Jul 17, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

Aluminum Alloy Vacuum Welding Plate Heat Exchanger for Auto Photovoltaic Semiconductor Industry

22124.

Aluminum Alloy Vacuum Welding Plate Heat Exchanger for Auto Photovoltaic Semiconductor Industry Open Details in New Window [Jul 16, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

304/316ss Machining Welding Vacuum Spiral Tube Cooler for Semiconductor Heat Exchanging

22125.

304/316ss Machining Welding Vacuum Spiral Tube Cooler for Semiconductor Heat Exchanging Open Details in New Window [Jul 15, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Application Our ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd