Jiangsu Profile
Product List
6766. Factory Infrared Picosecond Laser Cutting Machine for Sensor Glass Sapphire CE Certified 
[Jul 14, 2026]
[Jul 14, 2026] Factory Infrared Picosecond Laser Cutting Machine for Sensor Glass Sapphire CE Certified CHANXAN delivers professional IR picosecond cold laser precision processing solutions for automotive optical glass and ...
6767. Factory Chanxan UV Picosecond Laser Cutting Machine for FPC PCB CE Certified [Jul 14, 2026]
[Jul 14, 2026] Factory CHANXAN UV Picosecond Laser Cutting Machine for FPC PCB CE Certified CHANXAN delivers professional UV picosecond ultrafast laser precision processing solutions for 3C electronics, covering core processes ...
6768. Professional Laser Engraving Machine for Unique Jewelry Designs [Jul 15, 2026]
[Jul 15, 2026] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable ...
6769. Factory Femtosecond Laser Cutting Machine for FPC PCB Flexible Film CE Certified [Jul 13, 2026]
[Jul 13, 2026] Factory Femtosecond Laser Cutting Machine for FPC PCB Flexible Film CE Certified CHANXAN femtosecond ultrafast laser cutting machines fully meet strict precision and high yield standards for consumer 3C electronics, ...
6770. Premium Virgin PTFE Cleaning Basket for Semiconductor Wafer Processing [Jul 13, 2026]
[Jul 13, 2026] Product Description Technical Index Unit Value Specific Gravity g/cc 2.15-2.20 Tensile Strength Pa (1,961-3,521)x 10000 Elongation at Break % 250-500 Compressive Strength (10% deformation) Pa 19.52 x1000000 Impact ...
Company: Zhenjiang Hansa Sealant Co., Ltd.
6771. Advanced Grinding Technologies for Precision Wafer Thinning Processes [Jul 13, 2026]
[Jul 13, 2026] Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the ...
6772. High-Precision UV Laser Cutter for OLED Film Manufacturing [Jul 13, 2026]
[Jul 13, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, ...
6773. Advanced Manual Wafer Film Mounter for LED and PCB Applications [Jul 16, 2026]
[Jul 16, 2026] Product Description The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving design significantly ...
6774. High Precision Ultrafast Laser Cutting Machine for Semiconductor Wafer & 3c Cover Glass [Jul 10, 2026]
[Jul 10, 2026] ULTRAFAST GLASS LASER CUTTING MACHINE FOR SEMICONDUCTOR WAFER & 3C COVER GLASS CHANXAN focuses on ultrafast cold precision processing for brittle fragile materials, covering semiconductor glass wafer, 3C cover glass, ...
6775. Nanosecond Laser Cutting Machine with Linear Motor for Precision Thin Film Processing [Jul 09, 2026]
[Jul 09, 2026] Nanosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides Nanosecond laser cutting machines, with their core advantages of high precision, high stability, and wide material adaptability, are specifically ...
6776. High Definition UV Laser Marking Machine for Cosmetic Bottles [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6777. Advanced Laser Marking Systems for Long-Lasting Metal and Plastic [Jul 08, 2026]
[Jul 08, 2026] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on ...
6778. High Precision UV Laser Marking Machine for Fine Engraving [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6779. Factory Chanxan Picosecond Ultrafast Laser Cutting Machine for Glass Sapphire CE Certified [Jul 13, 2026]
[Jul 13, 2026] Factory CHANXAN Picosecond Ultrafast Laser Cutting Machine for Glass Sapphire CE Certified CHANXAN provides professional integrated ultrafast laser precision processing solutions for optical glass, sapphire wafer, 3C ...
6780. CNC Fiber Laser Scribing & Cutting Machine for Semiconductor Silicon Wafer Processing [Jul 07, 2026]
[Jul 07, 2026] HIGH PRECISION CNC FIBER LASER SCRIBING & CUTTING MACHINE FOR SEMICONDUCTOR SILICON WAFER CHANXAN CNC fiber laser scribing machine exclusively for semiconductor silicon wafer substrate processing. Core strengths: ...
