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Stainless Steel Ta1 Waste Gas Scrubbing Tower for Semiconductor Industry
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13471.

Stainless Steel Ta1 Waste Gas Scrubbing Tower for Semiconductor Industry Open Details in New Window [Sep 01, 2025]

Product Description Type Material Process Application Tube heat exchanger Customize according to needs: 304/304L,316/316L 2205, TA2/TA10, Q345R,09MnNiDR, N06200, C71500, R60702 ,N10276, N08810, BFe30-1-1, etc. stainless ...

Company: Jiangsu Xinmen Energy Equipment Co., Ltd.

High Accuracy CCD Auto Alignment Wafer Splitting Machine for Sic Semiconductor Chip
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13472.

High Accuracy CCD Auto Alignment Wafer Splitting Machine for Sic Semiconductor Chip Open Details in New Window [Jul 29, 2025]

Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing
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13473.

Semiconductor Wafer Cutting Machine for Si GaAs GaN Sic Wafer Stealth Dicing Open Details in New Window [Jul 25, 2025]

high-performance Wafer Dicing Machine Semiconductor Equipment Discover the high-precision Wafer Dicing Saw for semiconductor manufacturing. With linear motor drive, ±0.5μm repeatability, and laser alignment, this fully ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder
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13474.

Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder Open Details in New Window [Jul 23, 2025]

Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Original Factory Direct Price Automatic Semiconductor Equipment Die Bonding Machine
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13475.

Original Factory Direct Price Automatic Semiconductor Equipment Die Bonding Machine Open Details in New Window [Jul 23, 2025]

Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Custom-Made E. D. M Fabrication Small Fujilloy Tungsten Carbide Mold and Die Punch Components for ...
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13476.

Custom-Made E. D. M Fabrication Small Fujilloy Tungsten Carbide Mold and Die Punch Components for ... Open Details in New Window [Aug 19, 2024]

Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...

Company: Wuxi Sundi Precision Tools Co., Ltd

Industrial Mirro-Polished Precision CNC Machining Molding Al2O3 Aluminum Oxide Ceramic Zirconia for ...
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13477.

Industrial Mirro-Polished Precision CNC Machining Molding Al2O3 Aluminum Oxide Ceramic Zirconia for ... Open Details in New Window [Aug 31, 2023]

Company Profile Product Description Content Unit AL2O3 ZrO2 SiC Si3N4 Property 95%AL2O3 99%AL2O3 ZrO2 ZrO2 ZrO2 Mechanical Characteristics Color black faint ...

Company: Wuxi Sundi Precision Tools Co., Ltd

Semiconductor fab Water-cooled chiller with plant skid solution
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13478.

Semiconductor fab Water-cooled chiller with plant skid solution Open Details in New Window [Aug 27, 2025]

Product Description Type[SJSW-***A1] 20 30 40 50 60 Cooling working condition Refrigeration capacity U.S.RT 21.6 32.3 33.1 53.9 64.7 kW 75.8 113.7 151.6 189.5 227.5 Input power kW 15 22.5 30 37.5 45 COP kW/kW 5.1 5.1 ...

Company: Jiangsu Sujing Group Co., Ltd.

Semiconductor-Grade Plastic Components Front-Opening Unified Pod Manufacturer Certified Injection ...
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13479.

Semiconductor-Grade Plastic Components Front-Opening Unified Pod Manufacturer Certified Injection ... Open Details in New Window [Aug 25, 2025]

Plastic Parts CMP Retaining Ring for CMP process Injection Molding CMP-specific PEEK retaining rings, reinforced with nano-ceramics, have a flatness of <1μm/m, metal ion precipitation of <0.01ppb, and resistance to ...

Company: Jiangsu Maibo Intelligent Tech Co., Ltd

ISO 14644 Cleanroom Retaining Ring Injection Molding for Semiconductor Plastic Components
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13480.

ISO 14644 Cleanroom Retaining Ring Injection Molding for Semiconductor Plastic Components Open Details in New Window [Aug 25, 2025]

Plastic Parts CMP Retaining Ring for CMP process Injection Molding CMP-specific PEEK retaining rings, reinforced with nano-ceramics, have a flatness of <1μm/m, metal ion precipitation of <0.01ppb, and resistance to ...

Company: Jiangsu Maibo Intelligent Tech Co., Ltd

Precision Retaining Ring Plastic Parts for Semiconductor Manufacturing Equipment Injection Molding
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13481.

Precision Retaining Ring Plastic Parts for Semiconductor Manufacturing Equipment Injection Molding Open Details in New Window [Aug 25, 2025]

Plastic Parts CMP Retaining Ring for CMP process Injection Molding CMP-specific PEEK retaining rings, reinforced with nano-ceramics, have a flatness of <1μm/m, metal ion precipitation of <0.01ppb, and resistance to ...

Company: Jiangsu Maibo Intelligent Tech Co., Ltd

Premium Flying UV Fiber CO2 Laser Marking Machine Ultra-Precise Laser Engraving on Semiconductor ...
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13482.

Premium Flying UV Fiber CO2 Laser Marking Machine Ultra-Precise Laser Engraving on Semiconductor ... Open Details in New Window [Sep 06, 2025]

Flying UV Laser Marking Coding Printing Machine (Can be customized to your needs) High-speed UV laser printers are designed for batch products and feature automatic marking, assembly line production and high-speed ...

Company: SUZHOU HND LASER CO., LTD

Long-Lifespan UV Laser Marking Machine - Reliable Marks on Semiconductor Wafers/Glass Substrates ...
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13483.

Long-Lifespan UV Laser Marking Machine - Reliable Marks on Semiconductor Wafers/Glass Substrates ... Open Details in New Window [Sep 06, 2025]

Split Fiber Laser Marking Machine (Can be customized to your needs) Our portable laser markers boast unparalleled adaptability-surpassing conventional markers in versatility, making them ideal for a multitude of ...

Company: SUZHOU HND LASER CO., LTD

High-Performance Ball Screw for Semiconductor Equipment
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13484.

High-Performance Ball Screw for Semiconductor Equipment Open Details in New Window [Aug 11, 2025]

Product introduction Core Material S55c Scm450 Cable Length Customizable Quality Managem 100% Inspection Before Delivery MOQ 1 Set Delivery Time Sample 7days / Mass Production Depends on Quantity Product ...

Company: Wuxi Zeqing Automation Co., Ltd.

High-Performance Ball Screw for Semiconductor Industry
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13485.

High-Performance Ball Screw for Semiconductor Industry Open Details in New Window [Aug 11, 2025]

Product introduction Core Material S55c Scm450 Cable Length Customizable Quality Managem 100% Inspection Before Delivery MOQ 1 Set Delivery Time Sample 7days / Mass Production Depends on Quantity Product ...

Company: Wuxi Zeqing Automation Co., Ltd.