Jiangsu Profile
Product List
13546. High Concentricity Stainless Steel Wafer Ring Frame Dura420 SUS420J2 Materials 6 Inch Wafer Frame ... 
[Apr 02, 2025]
[Apr 02, 2025] High Concentricity Stainless Steel Wafer Ring Frame Dura420 SUS420J2 Materials 6 Inch Wafer Frame for Semiconductor Product Description Product Name 6" 8" 12" steel Metal Wafer Frame Ring For ...
Company: Wuxi Jinbao Special Steel Co., Ltd.
13547. 6" 8" 12" High Quality Dura420 SUS420J2 Wafer Ring for Semiconductor Industry Wafer Frame [Apr 02, 2025]
[Apr 02, 2025] 6" 8" 12" High Quality Dura420 SUS420J2 Wafer Ring for Semiconductor Industry Wafer Frame Product Description Product Name 6" 8" 12" steel Metal Wafer Ring For Semiconductor Application Semiconductor Laboratory ...
Company: Wuxi Jinbao Special Steel Co., Ltd.
13548. Alpha-335g Metallographic Slice Sand and Polish Semiconductor Chip Grinding and Polishing Machine ... [Mar 27, 2025]
[Mar 27, 2025] Model Alpha-335G Grinding stone Size Ø350xØ32x45mm Speed 100-1500rpm Rotation direction Counterclockwise Motor power (S1) 4.0kw Sample clamping disc Clamping disc diameter 160mm, maximum ...
13549. High End Semiconductor Wafer Saw Machine [Mar 25, 2025]
[Mar 25, 2025] High End Semiconductor Wafer Saw Machine Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of ...
13550. Semiconductor Equipment Wafer Loading and Unloading Wafer Mounter Dicing Turret Handler [Mar 19, 2025]
[Mar 19, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
13551. Semiconductor Low-Temperature Baking/Drying Equipment Fully Automatic Vacuum Vertical Oven [Mar 19, 2025]
[Mar 19, 2025] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
13552. Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach [Mar 19, 2025]
[Mar 19, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
13553. Electronical Grade 99.9999% Silane Gas Specialty Gas Sih4 for Semiconductor Industry and Chip ... [Mar 04, 2025]
[Mar 04, 2025] Product Description Essential details CAS No.: Other Names: 7803-62-5 Silane MF: EINECS No.: SiH4 232-263-4 Place of Origin: Grade Standard: Jiangsu, China Industrial Grade, Electron ...
Company: Jiangsu Huazhong Gas Co., Ltd.
13554. Desktop Automatic Glue Dispensing Machine Semiconductor Dispenser Device with Visual Function [Feb 28, 2025]
[Feb 28, 2025] Desktop Automatic Glue Dispensing Machine semiconductor Dispenser device with Visual Function Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
13555. Purity Customize Rectangle Frosty Fused Silica Wafer Quartz Glass Plate for Semiconductor [Feb 28, 2025]
[Feb 28, 2025] Customize Rectangle Frosty Fused Silica wafer Quartz Glass Plate for semiconductor: The adavantage of frosty fused quartz glass plate is not easy to be corroded, can withstand high temperature, beautiful appearance, ...
13556. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Feb 26, 2025]
[Feb 26, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
13557. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
13558. China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports ...
13559. High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
13560. Automatic Die Bonder Qfn Dfn Upload and Down Load Semiconductor Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
