Jiangsu Profile
Product List
13591. ODM Electroless Nickel Plated Hammer Ring Spanner for Semiconductor Wafer Handling 
[Apr 15, 2025]
[Apr 15, 2025] size 22mm 41mm 80mm 120mm 24mm 46mm 85mm 125mm 27mm 50mm 90mm 130mm 30mm 55mm 95mm 135mm 32mm 60mm 100mm 140mm 34mm 65mm 105mm 145mm 36mm 70mm 110mm 150mm 38mm 75mm 115mm 155mm ...
Company: Jiangsu Ruida Tools Co., Ltd.
13592. Vacuum High Temperature Oxygen Free Oven Semiconductor Equipment [Mar 21, 2025]
[Mar 21, 2025] Vacuum High Temperature Oxygen Free Oven Semiconductor Equipment Product Description Application introduction: Widely used in scientific research and production units such as aviation, aerospace, petroleum, ...
13593. Kaimei Silane Gas with 280L Cylinder Option for Semiconductor Industry [Mar 21, 2025]
[Mar 21, 2025] Product Description Silane is a colorless, reacting with air and can cause choking gas. The gas is usually caused by contact with air, it will burn and emit a very strong white amorphous silica smoke. The primary ...
13594. B300 Doped Poly Si Batch Wafers Semiconductor Equipment for Doped Ploy Si in DRAM [Mar 19, 2025]
[Mar 19, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is ...
13595. High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board ... [Mar 12, 2025]
[Mar 12, 2025] High Precision Dicing Saw Machine Fully Automatic for Silicon Wafers/Glass/Sic/PCB Board /Semiconductor Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery ...
13596. Wafer Dicing Saw for Semiconductor Industry Higher Movement Accuracy High Precision Dicing Machine [Feb 28, 2025]
[Feb 28, 2025] Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...
13597. Semiconductor Residue Removal Debonding Machine Manufacture and Test with Imported Advanced ... [Feb 28, 2025]
[Feb 28, 2025] Product Description features Automatic glue removeralso known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...
13598. Automatic Pipe Welding Machine Tube Orbital Welding Machine for S S Pipe, Food, Semiconductor ... [Feb 27, 2025]
[Feb 27, 2025] I. Closed Tube and Tube Welding Torch I.PRODUCT DESCRIPTION This welding gun is a special welding gun designed and developed for all position automatic welding of various pipe fittings. I.PRODUCT ...
Company: Wincoo Engineering Co., Ltd.
13599. Xd20W Automatic Pipe Welding Machine Tube Orbital Welding Machine for S S Pipe, Food, Semiconductor ... [Feb 27, 2025]
[Feb 27, 2025] I. Closed Tube and Tube Welding Torch I.PRODUCT DESCRIPTION This welding gun is a special welding gun designed and developed for all position automatic welding of various pipe fittings. I.PRODUCT ...
Company: Wincoo Engineering Co., Ltd.
13600. Wafer Size 6"- 8" Customized High Precision Semiconductor Die Bonder Die Bonding Machine for IC ... [Feb 26, 2025]
[Feb 26, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
13601. China Factory Price Pi Curing Oxygen-Free Oven for Semiconductor Manufacturing/COB Packaging [Feb 25, 2025]
[Feb 25, 2025] Product Description PI curing oxygen-free oven PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is ...
13602. Trim & Form System Semiconductor Equipment for Product Cutting/ Bending/Forming/Separation After ... [Feb 25, 2025]
[Feb 25, 2025] Product Description Main Features Equipment function: product cutting, bending, forming, and separation after plastic sealing; Applicable packaging: SOP/SSOP and other series; Punching power: servo motor upper power ...
13603. Semiconductor Automatic Chip Laying Machine for Semiconductor IC Packaging Production [Feb 25, 2025]
[Feb 25, 2025] Product Description Main Features Equipment function: Using a robotic arm to automatically grasp and discharge the lead frame; Applicable packaging: all packaging; Control system: PLC (Omron) Operating system: ...
13604. Semiconductor Strippers Equipment with Double Switch Protection/Emergency Stop Button Device [Feb 25, 2025]
[Feb 25, 2025] Product Description features Automatic glue removeralso known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...
13605. Semiconductor Auto Molding Equipment with Servo Control System, PLC (Omron) +Controller [Feb 25, 2025]
[Feb 25, 2025] Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...
