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Peek Seat Core for Electronic Semiconductors

13591.

Peek Seat Core for Electronic Semiconductors Open Details in New Window [Aug 21, 2024]

PEEK, PI has excellent electrical properties make it an excellent electrical insulator, may be in a very wide temperature, pressure and frequency fluctuation range, long-term stability. The ultra-high temperature ...

Company: Jiangsu Junhua Hpp Co., Ltd.

Peek Top off Cap for The Semiconductor Industry

13592.

Peek Top off Cap for The Semiconductor Industry Open Details in New Window [Aug 21, 2024]

PEEK, PI has excellent electrical properties make it an excellent electrical insulator, may be in a very wide temperature, pressure and frequency fluctuation range, long-term stability. The ultra-high ...

Company: Jiangsu Junhua Hpp Co., Ltd.

Peek Track Bar for Electronic Semiconductors

13593.

Peek Track Bar for Electronic Semiconductors Open Details in New Window [Aug 21, 2024]

PEEK, PI has excellent electrical properties make it an excellent electrical insulator, may be in a very wide temperature, pressure and frequency fluctuation range, long-term stability. The ultra-high temperature ...

Company: Jiangsu Junhua Hpp Co., Ltd.

7805 Three-Terminal Voltage-Regulator Chips/Wafer

13594.

7805 Three-Terminal Voltage-Regulator Chips/Wafer Open Details in New Window [Aug 20, 2024]

Die Size 1.39mm×1.72mm PD 15W ICC 7.3mA IOUT 1.5A Voltage Vin: 30V Vout: 4.9-5.1V Yangzhou Genesis Microelectronics Co., Ltd., a sino-foreign joint venture, is a national high-tech enterprise which ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

Tipp112 Darlington Transistors Chips/Wafer

13595.

Tipp112 Darlington Transistors Chips/Wafer Open Details in New Window [Aug 20, 2024]

Die Size 1.50mm×1.50mm BVCEO 100V BVCBO 150V BVEBO 6V IC 2A hFE 2000~15000 VCE(sat) 1.8V fT 10MHz Yangzhou Genesis Microelectronics Co., Ltd., a sino-foreign joint venture, is a national ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

Peek Wafer Chuck

13596.

Peek Wafer Chuck Open Details in New Window [Aug 21, 2024]

PEEK, PI has excellent electrical properties make it an excellent electrical insulator, may be in a very wide temperature, pressure and frequency fluctuation range, long-term stability. The ultra-high temperature ...

Company: Jiangsu Junhua Hpp Co., Ltd.

1A8 Resin Bond Diamond Blades

13597.

1A8 Resin Bond Diamond Blades Open Details in New Window [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

1A8 Metal Bond Cutting Blades

13598.

1A8 Metal Bond Cutting Blades Open Details in New Window [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

Negative Ion Needle

13599.

Negative Ion Needle Open Details in New Window [Aug 21, 2024]

1.what is silicon wafers and it's application: A silicon wafer is a material essential for manufacturing semiconductors, which are found in all kinds of electronic devices that enrich our lives. Silicon wafer ...

Company: Suzhou Henglixin New Material Co., Ltd.

10A 400V SMD Super Fast Recovery Diode Mur1040

13600.

10A 400V SMD Super Fast Recovery Diode Mur1040 Open Details in New Window [Dec 24, 2025]

Features Low cost Low leakage Low forward voltage drop High current capability Mechanical Data Case: TO-220AC Molding Compound: UL Flammability Classification Rating 94V-0 ...

Company: Jiangsu Zhongxin Semiconductor Co., Ltd.

Wafer Back & Front Wheels

13601.

Wafer Back & Front Wheels Open Details in New Window [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

Eletroformed Hubless Dicing Blades

13602.

Eletroformed Hubless Dicing Blades Open Details in New Window [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

Custom High Precision Ceramic Capillary for Semiconductor Wire Bonding IC Packaging

13603.

Custom High Precision Ceramic Capillary for Semiconductor Wire Bonding IC Packaging Open Details in New Window [Apr 23, 2026]

Taomsun high-precision ceramic capillaries are custom-designed for semiconductor IC packaging and wire bonding processes. These capillaries support gold, silver, copper, and aluminum wire bonding applications, featuring ...

Company: Suzhou Taomsun Scientific Instruments Co., Ltd

8 Inch Sic Wafer Substrate 4h-N Type

13604.

8 Inch Sic Wafer Substrate 4h-N Type Open Details in New Window [Apr 08, 2026]

Item 4H n-type SiC ...

Company: Jxt Technology Co., Ltd.

6 Inch Sic Wafer Substrate 4h-N Type

13605.

6 Inch Sic Wafer Substrate 4h-N Type Open Details in New Window [Apr 08, 2026]

Item 4H n-type SiC ...

Company: Jxt Technology Co., Ltd.