Jiangsu Profile
Product List
13711. Semiconductor Fully Automatic IC Marking Machine 
[Mar 25, 2025]
[Mar 25, 2025] Semiconductor Fully Automatic IC Marking Machine Product Description Introduction: Marking of SLOT form IC products suitable for packaging segments in the semiconductor industry. Mark relevant information such as ...
13712. Semiconductor Industry Process Fully Automatic IC Reel Packaging Equipment [Mar 20, 2025]
[Mar 20, 2025] Semiconductor Industry Process Fully Automatic IC Reel Packaging Equipment Product Description Application field: Mainly used for packaging 7-inch and 13-inch coils in the semiconductor industry process, it can ...
13713. Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine [Mar 19, 2025]
[Mar 19, 2025] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
13714. Silicon Carbide High Temperature Hmds Glue Applicator Automatic Manual Semiconductor Equipment ... [Mar 19, 2025]
[Mar 19, 2025] Silicon Carbide High Temperature HMDS Glue Applicator automatic manual semiconductor equipment manufacturer Product Description Certification ISO Warranty 1 year Automatic ...
13715. Semiconductor Wet Processing Equipment Accurate and Timely Chemical Reaction Process Temperature ... [Mar 19, 2025]
[Mar 19, 2025] Product Description Device Application Process Applied to realize wet processing such as RCA cleaning, Si etching, SiO2 etching , SiN etching metal layer corrosion, organic cleaning photoresist stripping ...
13716. High End Semiconductor Fully Automatic Llo Laser Peeling Machine [Mar 14, 2025]
[Mar 14, 2025] High End Semiconductor Fully Automatic Llo Laser Peeling Machine Product Description Using pulsed laser radiation with photon energy greater than GaN bandgap and smaller than sapphire bandgap to irradiate sapphire ...
13717. Custom High-Power Semiconductor and Power Electronics Fin Copper Heat Sink [Mar 03, 2025]
[Mar 03, 2025] Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...
13718. OEM High-Power Semiconductor and Power Electronics Fin Copper Heat Sink [Mar 03, 2025]
[Mar 03, 2025] Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...
13719. Semiconductor Devices Automatic High-Speed Lead Wire Welding and Bonding Machine [Feb 28, 2025]
[Feb 28, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
13720. Customized Design Hot Sale Semiconductor Equipment Wafer Scrubber [Feb 28, 2025]
[Feb 28, 2025] Product Description This series comprises special cleaning machines for wafers after polishing. They integrate automatic loading and unloading systems, double-sided PVA scrubbing, mega-sonic cleaning, spin drying & ...
13721. Factory Direct Sales Fully Automatic High-Precision Semiconductor Wafer Laser Grooving Machine [Feb 28, 2025]
[Feb 28, 2025] This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates ...
13722. High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate [Feb 26, 2025]
[Feb 26, 2025] Product Description Single machine plastic sealing equipment 1, Main parameters of the equipment 1. Mold closing pressure: 98-1176kN. 2. Injection pressure: 1-29.4kN. 3. Applicable lead frame/substrate size: width ...
13723. Zeolite Concentrator Concentrating System for Spray Painting, Printing, Electronic Sintering, ... [Feb 26, 2025]
[Feb 26, 2025] Product Description 1,Scope of application The organic waste gas flow rate is higher than 10000 Nm3/h; Concentration 300-1500 mg/m3; Subsequent direct combustion furnace, RTO or CO treatment are suitable for ...
13724. C300 Single Wafer Ald Semiconductor Equipment Is Mainly Used for Metal Gate [Feb 25, 2025]
[Feb 25, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is ...
13725. Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp ... [Feb 25, 2025]
[Feb 25, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
