Jiangsu Profile
Product List
13756. Tmac 75-57-0 Semiconductor Etching High Purity Low Residue 
[Aug 15, 2025]
[Aug 15, 2025] Product Description Product Name: Tetramethylammonium chloride CAS: 75-57-0 MF: C4H12ClN MW: 109.6 EINECS: 200-880-8 Melting point >300 °C (lit.) Boiling point 165.26°C (rough estimate) density 1,17 g/cm3 refractive ...
13757. Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment [Aug 15, 2025]
[Aug 15, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
13758. Corrosion Resistant Pneumatic Diaphragm Pump for Food, Chemical, Pharmaceutical, Semiconductor, ... [Aug 15, 2025]
[Aug 15, 2025] HCMAG Product Introduction Pneumatic Diaphragm Pump Product Brief 1. It can pump flowing liquid as well as convey some mediums which are not easy to flow, and has many advantages of self-priming pumps, submersible ...
13759. OEM Wholesale Automatic Metal Micro Small Machinery Automation Turned Semiconductor CNC Lathe ... [Sep 06, 2025]
[Sep 06, 2025] Product Name : oem Wholesale Automatic Metal Micro Small Machinery automation turned semiconductor CNC Lathe Machine Machined Turning Milling and Machining Parts Manufacturing Specification Product Description High ...
13760. Semiconductor Low-Temperature Baking/Drying Equipment Fully Automatic Vacuum Vertical Oven [Aug 14, 2025]
[Aug 14, 2025] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
13761. Continuous Automated Production Semiconductor Sic Composite Coating Vertical Furnace Integrated ... [Aug 14, 2025]
[Aug 14, 2025] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...
13762. Made in China Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Aug 14, 2025]
[Aug 14, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
13763. High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment [Aug 14, 2025]
[Aug 14, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
13764. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Aug 14, 2025]
[Aug 14, 2025] Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining ...
13765. High End Die Attach Bonder Equipment to Assist in Semiconductor Packaging [Aug 13, 2025]
[Aug 13, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
13766. Semiconductor Industry Pi Curing Oxygen-Free Oven Machine for Flexible Circuit Board Printing [Aug 11, 2025]
[Aug 11, 2025] Product Description PI curing oxygen-free oven PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is ...
13767. Semiconductor Bonding Equipment High Precision Wafer Placement Accuracy Die Bonder Machine [Aug 11, 2025]
[Aug 11, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
13768. Fully Automatic Semiconductor High-Precision Die Attach Provide Flexible Packaging Equipment [Aug 08, 2025]
[Aug 08, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
13769. Cleanroom 48W White 4300lm Ra80 PF0.95 130lm/W Semiconductor Teardrop Lamp LED Light [Aug 05, 2025]
[Aug 05, 2025] Company Profile Jiangsu Chuangxu Optoelectronics Co, Ltd Focus on Lighting Solution CX is a national high-tech enterprise focusing on clean room lighting products, integrating design, research and development and ...
Company: Jiangsu ChuangXu Optoelectronics Technology Co., Ltd.
13770. Cleanroom 65W White 5800lm Ra80 130lm/W PF0.95 Semiconductor Teardrop Lamp Light [Aug 05, 2025]
[Aug 05, 2025] Company Profile Jiangsu Chuangxu Optoelectronics Co, Ltd Focus on Lighting Solution CX is a national high-tech enterprise focusing on clean room lighting products, integrating design, research and development ...
Company: Jiangsu ChuangXu Optoelectronics Technology Co., Ltd.
