Jiangsu Profile
Product List
13696. High Purity Hydrogen Bromide Gas for Industrial Semiconductor Use 99.999% 
[May 29, 2025]
[May 29, 2025] Product Description Basic Info. Model NO. Hbr Transport Package Cylinder Specification 10L / 47L Trademark Deou Origin Suzhou HS Code 2811299000 Product Description Product Information Our High Purity ...
13697. Fluorine Lined Sulphuric Acid Magnetic Drive Pump for Semiconductor and PCB Industry [May 19, 2025]
[May 19, 2025] HCMAG Product Introduction GDM Series Product Brief One-piece metal lined construction designed to resist negative pressure operation. High purity PFA/ETFE liners are suitable for high purity fluids and have ...
13698. Horizontal High Temperature Fluorine Lined Magnetic Pump for Semiconductor Industry [May 15, 2025]
[May 15, 2025] HCMAG Product Introduction GDM Series Product Brief One-piece metal lined construction designed to resist negative pressure operation. High purity PFA/ETFE liners are suitable for high purity fluids and have ...
13699. Oil & Gas Seals Semiconductor Wafer Carriers 4, 4’ -Difluorobenzophenone ... [Apr 03, 2025]
[Apr 03, 2025] Chemical Name poly-ether-ether-ketone Molecular Formula C19H14F2O3 Molecular Weight 328.31 EINECS -- CAS 29658-26-2 Trademark Xinsu Appearance Liquid Color Colorless Suzhou Xinsu Advanced Materials Co., ...
Company: Jiangsu Xinsu New Materials Co., Ltd
13700. Premium Half Round Fused Quartz Rod for Semiconductor Applications [Mar 28, 2025]
[Mar 28, 2025] Product Description It's made from natural quartz after the process of melting and fine grinding. It has high purity, heat resistance and corrosion resistance, also be low coefficient of thermal expansion. It ...
Company: Lianyungang Yongsin Quartz Co., Ltd.
13701. High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment [Mar 24, 2025]
[Mar 24, 2025] High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment Product Description 1. Customer products The product is shown in the following diagram Loading and unloading of material boxes 2. ...
13702. Dbc Sintering Furnace for High Temperature Heat Treatment of Power Semiconductor Devices [Mar 24, 2025]
[Mar 24, 2025] Dbc Sintering Furnace for High Temperature Heat Treatment of Power Semiconductor Devices Product Description 1. Technical indicators The use of temperature RT-1100 C. The uniformity of the furnace is better than ...
13703. High End Semiconductor Packaging Process IC Chip Marking Machine [Mar 21, 2025]
[Mar 21, 2025] High End Semiconductor Packaging Process IC Chip Marking Machine Product Description During the semiconductor packaging process, frame baking, electroplating, rib cutting, marking, and other processes all require ...
13704. Flip Chip Die Bonder Machine for Semiconductor Packaging [Mar 20, 2025]
[Mar 20, 2025] Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and ...
13705. Vacuum Baking Equipment Suitable for Mems/ Power Semiconductor/Advanced Packaging/Optoelectronics [Mar 19, 2025]
[Mar 19, 2025] Vacuum Baking Equipment Suitable for Mems/ Power Semiconductor/Advanced Packaging/Optoelectronics Product Description VJS-80 vacuum purification (degassing) furnace VJS-80 vacuum purification furnace is mainly ...
13706. Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach [Mar 19, 2025]
[Mar 19, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
13707. Industry High-End Semiconductor Fully Automatic Wafer Marking Machine [Mar 19, 2025]
[Mar 19, 2025] Product Description 1. Product size compatibility: 8-12 inch bare wafer; 2. Equipped with a wafer loading system called Loadport, supporting FOUP loading; 3. Robot robotic arm film transmission; 4. Automatic ...
13708. High Precision Eutectic &Exopy Die Attach Die Bonder Die Bonding Machine for Semiconductor Industry [Mar 17, 2025]
[Mar 17, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
13709. Fully Automatic Laser Grooving Equipment for Semiconductor Wafers [Mar 13, 2025]
[Mar 13, 2025] Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...
13710. #Nailok UHP SS316L Regulator 0-150psi Outlet Pressure Sinlge 1/4"Female Pressure Reducing Valve ... [Mar 13, 2025]
[Mar 13, 2025] 3000psi SS316 Stainless Steel Diaphragm Valve The structure of the diaphragm valve is very different from that of ordinary valves. It is a new type of valve and a special type of block valve. Its opening and closing ...
